P

Inventor

MOTSIFF WILLIAM T

US52 patents
⚠️ This page may combine multiple inventors who share the name “MOTSIFF WILLIAM T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

49 patents
US7071532B2Jul 4, 2006

Adjustable self-aligned air gap dielectric for low capacitance wiring

IBM243 citations99
US6498385B1Dec 24, 2002

Post-fuse blow corrosion prevention structure for copper fuses

IBM68 citations96
US6498056B1Dec 24, 2002

Apparatus and method for antifuse with electrostatic assist

IBM69 citations96
US7335577B2Feb 26, 2008

Crack stop for low K dielectrics

IBM47 citations95
US6773952B2Aug 10, 2004

Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces

IBM45 citations95
US5457345AOct 10, 1995

Metallization composite having nickle intermediate/interface

IBM56 citations94
US7207096B2Apr 24, 2007

Method of manufacturing high performance copper inductors with bond pads

IBM23 citations93
US6924210B1Aug 2, 2005

Chip dicing

IBM23 citations93
US6844609B2Jan 18, 2005

Antifuse with electrostatic assist

IBM30 citations93
US6746947B2Jun 8, 2004

Post-fuse blow corrosion prevention structure for copper fuses

IBM20 citations93
US6667533B2Dec 23, 2003

Triple damascene fuse

IBM31 citations93
US6375159B2Apr 23, 2002

High laser absorption copper fuse and method for making the same

IBM21 citations93
US6806578B2Oct 19, 2004

Copper pad structure

IBM32 citations92
US6573538B2Jun 3, 2003

Semiconductor device with internal heat dissipation

IBM19 citations92
US6559543B1May 6, 2003

Stacked fill structures for support of dielectric layers

IBM18 citations92
US6512292B1Jan 28, 2003

Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces

IBM34 citations92
US6458630B1Oct 1, 2002

Antifuse for use with low k dielectric foam insulators

IBM33 citations92
US6261873B1Jul 17, 2001

Pedestal fuse

IBM19 citations92
US7521336B2Apr 21, 2009

Crack stop for low K dielectrics

IBM22 citations91
US6982227B2Jan 3, 2006

Single and multilevel rework

IBM16 citations91
US6674168B1Jan 6, 2004

Single and multilevel rework

IBM17 citations91
US7358148B2Apr 15, 2008

Adjustable self-aligned air gap dielectric for low capacitance wiring

IBM14 citations84
US6798066B1Sep 28, 2004

Heat dissipation from IC interconnects

IBM17 citations83
US6661106B1Dec 9, 2003

Alignment mark structure for laser fusing and method of use

IBM14 citations83
US6496053B1Dec 17, 2002

Corrosion insensitive fusible link using capacitance sensing for semiconductor devices

IBM17 citations83
US4590258AMay 20, 1986

Polyamic acid copolymer system for improved semiconductor manufacturing

IBM22 citations78
US6827868B2Dec 7, 2004

Thinning of fuse passivation after C4 formation

IBM10 citations74
US6784516B1Aug 31, 2004

Insulative cap for laser fusing

IBM5 citations74
US6734047B1May 11, 2004

Thinning of fuse passivation after C4 formation

IBM7 citations74
US6335229B1Jan 1, 2002

Inductive fuse for semiconductor device

IBM11 citations74
US7064409B2Jun 20, 2006

Structure and programming of laser fuse

IBM6 citations73
US6492207B2Dec 10, 2002

Method for making a pedestal fuse

IBM7 citations73
US6844747B2Jan 18, 2005

Wafer level system for producing burn-in/screen, and reliability evaluations to be performed on all chips simultaneously without any wafer contacting

IBM6 citations71
US8044510B2Oct 25, 2011

Product and method for integration of deep trench mesh and structures under a bond pad

IBM2 citations63
US7482258B2Jan 27, 2009

Product and method for integration of deep trench mesh and structures under a bond pad

IBM2 citations63
US7045472B2May 16, 2006

Method and apparatus for selectively altering dielectric properties of localized semiconductor device regions

IBM3 citations63
US6991971B2Jan 31, 2006

Method for fabricating a triple damascene fuse

IBM2 citations63
US6946379B2Sep 20, 2005

Insulative cap for laser fusing

IBM2 citations63
US6876058B1Apr 5, 2005

Wiring protection element for laser deleted tungsten fuse

IBM5 citations63
US6743710B2Jun 1, 2004

Stacked fill structures for support of dielectric layers

IBM4 citations63
US6713838B2Mar 30, 2004

Inductive fuse for semiconductor device

IBM3 citations63
US7981732B2Jul 19, 2011

Programming of laser fuse

IBM2 citations62
US7384824B2Jun 10, 2008

Structure and programming of laser fuse

IBM2 citations62
US6815838B2Nov 9, 2004

Laser alignment target and method

IBM4 citations62
US6455914B2Sep 24, 2002

Pedestal fuse

IBM2 citations62
US6420772B1Jul 16, 2002

Re-settable tristate programmable device

IBM3 citations61
US7786549B2Aug 31, 2010

Antifuse structure and system for closing thereof

IBM0 citations52
US7115968B2Oct 3, 2006

Method of closing an antifuse using laser energy

IBM0 citations52
US6835973B2Dec 28, 2004

Antifuse for use with low κ dielectric foam insulators

IBM0 citations52

INFINEON TECHNOLOGIES AG

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.