Inventor
HEO YOUNG WOOK
KR24 patents
⚠️ This page may combine multiple inventors who share the name “HEO YOUNG WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ANAM SEMICONDUCTOR INC
9 patentsUS5953589ASep 14, 1999
Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same
ANAM SEMICONDUCTOR INC139 citations98
US5905633AMay 18, 1999
Ball grid array semiconductor package using a metal carrier ring as a heat spreader
ANAM SEMICONDUCTOR INC128 citations98
US6091141AJul 18, 2000
Bump chip scale semiconductor package
ANAM SEMICONDUCTOR INC51 citations96
US5864470AJan 26, 1999
Flexible circuit board for ball grid array semiconductor package
ANAM SEMICONDUCTOR INC75 citations96
US5858815AJan 12, 1999
Semiconductor package and method for fabricating the same
ANAM SEMICONDUCTOR INC80 citations96
US6021563AFeb 8, 2000
Marking Bad printed circuit boards for semiconductor packages
ANAM SEMICONDUCTOR INC20 citations93
US5977624ANov 2, 1999
Semiconductor package and assembly for fabricating the same
ANAM SEMICONDUCTOR INC33 citations93
US5981873ANov 9, 1999
Printed circuit board for ball grid array semiconductor package
ANAM SEMICONDUCTOR INC42 citations92
US5897334AApr 27, 1999
Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards
ANAM SEMICONDUCTOR INC26 citations92
AMKOR TECHNOLOGY INC
8 patentsUS6987314B1Jan 17, 2006
Stackable semiconductor package with solder on pads on which second semiconductor package is stacked
AMKOR TECHNOLOGY INC106 citations99
US6555917B1Apr 29, 2003
Semiconductor package having stacked semiconductor chips and method of making the same
AMKOR TECHNOLOGY INC353 citations99
US6946323B1Sep 20, 2005
Semiconductor package having one or more die stacked on a prepackaged device and method therefor
AMKOR TECHNOLOGY INC73 citations98
US6879047B1Apr 12, 2005
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
AMKOR TECHNOLOGY INC55 citations96
US6389689B2May 21, 2002
Method of fabricating semiconductor package
AMKOR TECHNOLOGY INC46 citations92
US7459349B1Dec 2, 2008
Method of forming a stack of semiconductor packages
AMKOR TECHNOLOGY INC9 citations84
US7982306B1Jul 19, 2011
Stackable semiconductor package
AMKOR TECHNOLOGY INC5 citations74
US7737542B1Jun 15, 2010
Stackable semiconductor package
AMKOR TECHNOLOGY INC5 citations74
ANAM IND CO LTD
3 patentsUS5915169AJun 22, 1999
Semiconductor chip scale package and method of producing such
ANAM IND CO LTD197 citations99
US5708567AJan 13, 1998
Ball grid array semiconductor package with ring-type heat sink
ANAM IND CO LTD95 citations98
US5767446AJun 16, 1998
Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package
ANAM IND CO LTD116 citations97