Inventor · disambiguated record
Tsu-An Lin
Also filed as: LIN TSU C · LIN TSU-AN
8 granted patents·2 pending applications·106 citations·filing 1998–2005
87Inventor score
Files withUNITED MICROELECTRONICS CORP6NANYA TECHNOLOGY CORP2FORMOSA PLASMA DISPLAY CORP1NASU AKINOBU1
Top patents by PatentIndex Score
10 records- 0161US6066541AMethod for fabricating a cylindrical capacitorNANYA TECHNOLOGY CORP·Filed 1998·Granted May 23, 2000·26 cites·23 claims
- 0248US6277736B1Method for forming gateUNITED MICROELECTRONICS CORP·Filed 1998·Granted Aug 21, 2001·19 cites·8 claims
- 0347US5923989AMethod of fabricating rugged capacitor of high density DRAMsNANYA TECHNOLOGY CORP·Filed 1998·Granted Jul 13, 1999·12 cites·33 claims
- 0445US6150223AMethod for forming gate spacers with different widthsUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 21, 2000·16 cites·12 claims
- 0544US6197698B1Method for etching a poly-silicon layer of a semiconductor waferUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 6, 2001·11 cites·6 claims
- 0641US6380082B2Method of fabricating Cu interconnects with reduced Cu contaminationUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 30, 2002·10 cites·20 claims
- 0741US2006001354A1Transparent electrode for plasma display panelFORMOSA PLASMA DISPLAY CORP·Filed 2005·Application pending·0 cites
- 0840US6180532B1Method for forming a borderless contact holeUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 30, 2001·8 cites·2 claims
- 0938US2009004372A1Electroless Niwp Adhesion and Capping Layers for Tft Copper Gate ProcessNASU AKINOBU·Filed 2005·Application pending·0 cites
- 1033US5994233AOxide etching methodUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 30, 1999·4 cites·11 claims
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