Inventor

HSU JIMMY

TW21 patents

⚠️ This page may combine multiple inventors who share the name “HSU JIMMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU JIMMY

VIA TECH INC

Signal transmission structure having plural reference planes with non-overlapping openings

Multi-conducting through hole structure

Flip-chip package substrate

Transformer former between two layout layers

Method for analyzing power distribution system and related techniques

Signal transmission structure and circuit substrate thereof

Flip-chip package substrate

Surrounding structure for a probe card

Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure

Signal transmission structure

Bonding pad design for impedance matching improvement

Chip package structure

Testing circuit and related method of injecting a time jitter

Signal transmission structure having salients aligned with non-reference regions

Voltage reference signal circuit layout inside multi-layered substrate

Chip package

INTEL CORP

Signal line pairs on a circuit board which are displaced from each other relative to a center line

Dielectric coating for crosstalk reduction

Reduction of insertion loss in printed circuit board signal traces

JIAXING ZHONGLI PLASTIC CO LTD

Food container and container lid

BANYAN INT LLC

Portion cup