Inventor
YEW CHEE KIANG
SG15 patents
⚠️ This page may combine multiple inventors who share the name “YEW CHEE KIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
14 patentsUS6049129AApr 11, 2000
Chip size integrated circuit package
TEXAS INSTRUMENTS INC108 citations96
US5956233ASep 21, 1999
High density single inline memory module
TEXAS INSTRUMENTS INC132 citations96
US6387729B2May 14, 2002
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC48 citations95
US6365833B1Apr 2, 2002
Integrated circuit package
TEXAS INSTRUMENTS INC70 citations95
US6091140AJul 18, 2000
Thin chip-size integrated circuit package
TEXAS INSTRUMENTS INC114 citations95
US6087203AJul 11, 2000
Method for adhering and sealing a silicon chip in an integrated circuit package
TEXAS INSTRUMENTS INC45 citations95
US6278616B1Aug 21, 2001
Modifying memory device organization in high density packages
TEXAS INSTRUMENTS INC55 citations94
US6602803B2Aug 5, 2003
Direct attachment semiconductor chip to organic substrate
TEXAS INSTRUMENTS INC27 citations92
US6218202B1Apr 17, 2001
Semiconductor device testing and burn-in methodology
TEXAS INSTRUMENTS INC101 citations92
US6084306AJul 4, 2000
Bridging method of interconnects for integrated circuit packages
TEXAS INSTRUMENTS INC37 citations92
US6468831B2Oct 22, 2002
Method of fabricating thin integrated circuit units
TEXAS INSTRUMENTS INC43 citations90
US6274929B1Aug 14, 2001
Stacked double sided integrated circuit package
TEXAS INSTRUMENTS INC35 citations90
US7042070B2May 9, 2006
Direct attachment of semiconductor chip to organic substrate
TEXAS INSTRUMENTS INC8 citations74
US6768646B1Jul 27, 2004
High density internal ball grid array integrated circuit package
TEXAS INSTRUMENTS INC7 citations70