Stacked double sided integrated circuit package

Abstract

A high density unit ( 130, 160 ) comprising a first integrated circuit package ( 30, 32 ) comprising a carrier ( 70 ) having first and second sides ( 92, 94 ), a silicon chip ( 50 ) attached by an adhesive layer ( 60 ) and solder bonding ( 80 ) electrically connecting the silicon chip ( 50 ) to the carrier ( 70 ) stackably and electrically connected to a second integrated circuit package ( 30, 32 ), is disclosed.

What is claimed is:  
     
       1. An integrated circuit package which comprises: 
       a first carrier having a first pair of opposing surfaces, each surface having a pair of opposing end portions with terminals on both of said opposing surfaces and at both of said opposing end portions;  
       a first interconnect disposed in said first carrier extending to at least one of said terminals on each of said first pair of opposing surfaces;  
       a first semiconductor chip having a bonding pad, said first semiconductor chip attached to said first carrier by an adhesive layer;  
       a first interconnection electrically connecting said first semiconductor chip bonding pad to said first interconnect by a routing strip in said first carrier, wherein said routing strip is directly connected to said first connection; and  
       a solder ball connected to said terminals on both of said surfaces.  
     
     
       2. The package of claim  1  wherein said connection is a solder connection. 
     
     
       3. The package of claim  2  further including a second carrier having a pair of opposing surfaces, each surface having a pair of opposing end portions with terminals on both of said opposing surfaces and both of said opposing end portions, a second interconnect disposed in said second carrier extending to at least one of said terminals of said second carrier, a second semiconductor chip having a bonding pad, said second semiconductor chip attached to said second carrier by an adhesive layer, a connection electrically connecting said second semiconductor chip bonding pad to said second interconnect; a solder ball on each of said terminals on a first of said surfaces of said second carrier, the solder balls on one of said surfaces of said first carrier being in contact with the terminals of the second surface of said second carrier. 
     
     
       4. The package of claim  3  wherein said connection is a solder connection. 
     
     
       5. The package of claim  4  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls. 
     
     
       6. The package of claim  3  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls. 
     
     
       7. The package of claim  2  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls. 
     
     
       8. The package of claim  1  further including a second carrier having a pair of opposing surfaces, each surface having a pair of opposing end portions with terminals on both of said opposing surfaces and both of said opposing end portions, a second interconnect disposed in said second carrier extending to at least one of said terminals of said second carrier, a second semiconductor chip having a bonding pad, said second semiconductor chip attached to said second carrier by an adhesive layer, a connection electrically connecting said second semiconductor chip bonding pad to said second interconnect; a solder ball on each of said terminals on a first of said surfaces of said second carrier, the solder balls on one of said surfaces of said first carrier being in contact with the terminals of the second surface of said second carrier. 
     
     
       9. The package of claim  8  wherein said connection is a solder connection. 
     
     
       10. The package of claim  9  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls. 
     
     
       11. The package of claim  8  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls. 
     
     
       12. The package of claim  1  further including a circuit board having terminals, said package being connected to said circuit board by means of said solder balls.