Inventor · disambiguated record
Pang Hup Ong
Also filed as: ONG PANG HUP
7 granted patents·1 pending application·307 citations·filing 1997–2011
86Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC5CASTILLO DENVER PAUL C1KOH YONG CHUAN1UTAC UNITED TEST AND ASSEMBLY1
Top patents by PatentIndex Score
8 records- 0187US6091140AThin chip-size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 18, 2000·114 cites·13 claims
- 0287US6049129AChip size integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 11, 2000·108 cites·36 claims
- 0385US6468831B2Method of fabricating thin integrated circuit unitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 22, 2002·43 cites·9 claims
- 0469US6274929B1Stacked double sided integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 14, 2001·35 cites·12 claims
- 0537US8592258B2Semiconductor package and method of attaching semiconductor dies to substratesCASTILLO DENVER PAUL C·Filed 2011·Granted Nov 26, 2013·0 cites·20 claims
- 0637US2009194871A1Semiconductor package and method of attaching semiconductor dies to substratesUTAC UNITED TEST AND ASSEMBLY·Filed 2008·Application pending·0 cites
- 0734US6768646B1High density internal ball grid array integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 27, 2004·7 cites·20 claims
- 0827US8247272B2Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding processKOH YONG CHUAN·Filed 2009·Granted Aug 21, 2012·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →