Inventor
TANIDA KAZUMASA
JP53 patents
⚠️ This page may combine multiple inventors who share the name “TANIDA KAZUMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ROHM CO LTD
18 patentsUS7598613B2Oct 6, 2009
Flip chip bonding structure
ROHM CO LTD44 citations93
US7432196B2Oct 7, 2008
Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
ROHM CO LTD23 citations92
US7122457B2Oct 17, 2006
Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
ROHM CO LTD30 citations92
US6995455B2Feb 7, 2006
Semiconductor device
ROHM CO LTD24 citations92
US7235428B2Jun 26, 2007
Semiconductor device production method
ROHM CO LTD11 citations84
US7638421B2Dec 29, 2009
Manufacturing method for semiconductor device and semiconductor device
ROHM CO LTD6 citations74
US7456502B2Nov 25, 2008
Wiring board with connection electrode formed in opening and semiconductor device using the same
ROHM CO LTD7 citations74
US11842972B2Dec 12, 2023
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD1 citations63
US11355462B2Jun 7, 2022
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations63
US7405485B2Jul 29, 2008
Semiconductor device
ROHM CO LTD4 citations63
US10818628B2Oct 27, 2020
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US10522494B2Dec 31, 2019
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9831204B2Nov 28, 2017
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9721865B2Aug 1, 2017
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US9117774B2Aug 25, 2015
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US8754535B2Jun 17, 2014
Semiconductor device with a semiconductor chip connected in a flip chip manner
ROHM CO LTD0 citations52
US7928581B2Apr 19, 2011
Semiconductor device having a conductive member including an end face substantially fush with an end face of a wiring board and method of manufacturing the same
ROHM CO LTD1 citations52
US7061107B2Jun 13, 2006
Semiconductor device and manufacturing method of the same
ROHM CO LTD0 citations52
TANIDA KAZUMASA
11 patentsUS8778778B2Jul 15, 2014
Manufacturing method of semiconductor device, semiconductor substrate, and camera module
TANIDA KAZUMASA8 citations82
US8405227B2Mar 26, 2013
Semiconductor device with a semiconductor chip connected in a flip chip manner
TANIDA KAZUMASA3 citations73
US8426977B2Apr 23, 2013
Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module
TANIDA KAZUMASA5 citations72
US8552545B2Oct 8, 2013
Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
TANIDA KAZUMASA3 citations62
US8338904B2Dec 25, 2012
Semiconductor device and method for manufacturing the same
TANIDA KAZUMASA3 citations62
US8269315B2Sep 18, 2012
Semiconductor device and method of manufacturing semiconductor device
TANIDA KAZUMASA4 citations62
US8237285B2Aug 7, 2012
Semiconductor device, through hole having expansion portion and thin insulating film
TANIDA KAZUMASA3 citations62
US8089163B2Jan 3, 2012
Semiconductor device production method and semiconductor device
TANIDA KAZUMASA2 citations62
US8063462B2Nov 22, 2011
Semiconductor device and method of manufacturing the same
TANIDA KAZUMASA6 citations62
US8404586B2Mar 26, 2013
Manufacturing method for semiconductor device
TANIDA KAZUMASA0 citations52
US8309430B2Nov 13, 2012
Semiconductor manufacturing apparatus and semiconductor manufacturing method
TANIDA KAZUMASA1 citations51
TOSHIBA KK
6 patentsUS7282444B2Oct 16, 2007
Semiconductor chip and manufacturing method for the same, and semiconductor device
TOSHIBA KK62 citations98
US7808064B2Oct 5, 2010
Semiconductor package including through-hole electrode and light-transmitting substrate
TOSHIBA KK26 citations92
US7259454B2Aug 21, 2007
Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
TOSHIBA KK37 citations92
US9679867B2Jun 13, 2017
Semiconductor device having a low-adhesive bond substrate pair
TOSHIBA KK15 citations91
US9165962B2Oct 20, 2015
Solid state imaging device
TOSHIBA KK6 citations73
US7888760B2Feb 15, 2011
Solid state imaging device and method for manufacturing same, and solid state imaging module
TOSHIBA KK5 citations62
TOSHIBA MEMORY CORP
3 patentsUS10090351B2Oct 2, 2018
Semiconductor device having gaps within the conductive parts
TOSHIBA MEMORY CORP11 citations83
US9761463B2Sep 12, 2017
Semiconductor device and semiconductor device manufacturing method
TOSHIBA MEMORY CORP9 citations83
US9935232B2Apr 3, 2018
Method of manufacturing semiconductor device
TOSHIBA MEMORY CORP2 citations68
RENESAS TECH CORP
2 patentsSANYO ELECTRIC CO
2 patentsHONGO SATOSHI
2 patentsMATSUO MIE
1 patentYAMAGUCHI NAOKO
1 patentUMEMOTO MITSUO
1 patentSONY SEMICONDUCTOR SOLUTIONS CORP
1 patentTAKANO EIJI
1 patentSHIRONO TAKASHI
1 patentShowing the top 50 of 53 patents by PatentIndex Score.