Inventor

OLSON TIMOTHY L

US54 patents

⚠️ This page may combine multiple inventors who share the name “OLSON TIMOTHY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OLSON TIMOTHY L

DECA TECH USA INC

Semiconductor assembly comprising a 3D block and method of making the same

Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

Fully molded semiconductor structure with face mounted passives and method of making the same

Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages

Semiconductor assembly comprising a 3D block and method of making the same

Fully molded bridge interposer and method of making the same

Fully molded bridge interposer and method of making the same

Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

Molded direct contact interconnect structure without capture pads and method for the same

Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the same

Molded direct contact interconnect structure without capture pads and method for the same

Fully molded semiconductor structure with through silicon via (TSV) vertical interconnects

Lot of devices with repairable redistribution layer (RDL) design with a custom RDL

Unit specific variable or adaptive metal fill and system and method for the same

Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDL

Unit specific variable or adaptive metal fill and system and method for the same

Stackable fully molded semiconductor structure with vertical interconnects

Fully molded semiconductor structure with face mounted passives and method of making the same

Method of making a fan-out semiconductor assembly with an intermediate carrier

Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the same

Fully molded structure with multi-height components comprising backside conductive material and method for making the same

DECA TECHNOLOGIES INC

Semiconductor device and method of adaptive patterning for panelized packaging

Fully molded miniaturized semiconductor module

Semiconductor device and method of adaptive patterning for panelized packaging

Fully molded miniaturized semiconductor module

Adaptive patterning for panelized packaging

Adaptive patterning for panelized packaging

Semiconductor device and method of land grid array packaging with bussing lines

Adaptive patterning for panelized packaging

Fully molded semiconductor package for power devices and method of making the same

Automated optical inspection of unit specific patterning

Stackable fully molded semiconductor structure with vertical interconnects

Semiconductor device processing method for material removal

Semiconductor device and method of packaging

Automated optical inspection of unit specific patterning

Semiconductor device processing method for material removal

MOTOROLA INC

Reduced stress plastic package

Semiconductor package

Method and apparatus for modeling process control

Non-contact lead design and package

Semiconductor package having isolated heatsink bonding pads

Lead frame assembly for surface mount integrated circuit power package

AMKOR TECHNOLOGY INC

Semiconductor device having EMI shielding and method therefor

Semiconductor device having RF shielding and method therefor

OLSON TIMOTHY L

Biometric deadbolt lock assembly

Substrate carrier for wet chemical processing

SCANLAN CHRISTOPHER M

Adaptive patterning for panelized packaging

CHOI YEONHO

Flat semiconductor package with half package molding

KUO BOB SHIH WEI

Leadframe structure for concentrated photovoltaic receiver package

KARIM NOZAD O

Semiconductor device with increased I/O leadframe including passive device