USD345731SExpiredUtility

Semiconductor package

Assignee: MOTOROLA INCPriority: Dec 3, 1992Filed: Dec 3, 1992Granted: Apr 5, 1994
Est. expiryDec 3, 2012(expired)· nominal 20-yr term from priority
94
PatentIndex Score
52
Cited by
6
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a semiconductor package, as shown and described.

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