Inventor · disambiguated record
Timothy L. Olson
Also filed as: OLSON TIMOTHY · OLSON TIMOTHY L · OLSON TIMOTHY LEE
56 granted patents·15 pending applications·1,038 citations·filing 1991–2025
98Inventor score
Files withDECA TECH USA INC37DECA TECHNOLOGIES INC16MOTOROLA INC7AMKOR TECHNOLOGY INC2OLSON TIMOTHY L2
Top patents by PatentIndex Score
71 records- 0198US7745910B1Semiconductor device having RF shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Jun 29, 2010·115 cites·20 claims
- 0297US9887103B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 6, 2018·40 cites·20 claims
- 0397US9831170B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2016·Granted Nov 28, 2017·29 cites·20 claims
- 0497US7898066B1Semiconductor device having EMI shielding and method thereforAMKOR TECHNOLOGY INC·Filed 2007·Granted Mar 1, 2011·71 cites·11 claims
- 0596US10373902B2Fully molded miniaturized semiconductor moduleDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 6, 2019·14 cites·20 claims
- 0696US8236151B1Substrate carrier for wet chemical processingOLSON TIMOTHY L·Filed 2010·Granted Aug 7, 2012·28 cites·19 claims
- 0795US8799845B2Adaptive patterning for panelized packagingSCANLAN CHRISTOPHER M·Filed 2010·Granted Aug 5, 2014·24 cites·16 claims
- 0895US5278446AReduced stress plastic packageMOTOROLA INC·Filed 1992·Granted Jan 11, 1994·301 cites·1 claims
- 0994US12205881B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2023·Granted Jan 21, 2025·2 cites·30 claims
- 1094US11056453B2Stackable fully molded semiconductor structure with vertical interconnectsDECA TECHNOLOGIES INC·Filed 2020·Granted Jul 6, 2021·5 cites·19 claims
- 1194US8536462B1Flex circuit package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Sep 17, 2013·41 cites·20 claims
- 1294USD345731SSemiconductor packageMOTOROLA INC·Filed 1992·Granted Apr 5, 1994·52 cites·1 claims
- 1393US11616003B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Mar 28, 2023·2 cites·18 claims
- 1493US9196509B2Semiconductor device and method of adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Nov 24, 2015·16 cites·20 claims
- 1592US7908896B1Biometric deadbolt lock assemblyOLSON TIMOTHY L·Filed 2006·Granted Mar 22, 2011·49 cites·39 claims
- 1691US12424527B2Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·1 cites·27 claims
- 1791US8680656B1Leadframe structure for concentrated photovoltaic receiver packageKUO BOB SHIH WEI·Filed 2009·Granted Mar 25, 2014·22 cites·20 claims
- 1890US11444051B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2021·Granted Sep 13, 2022·2 cites·20 claims
- 1990US9418905B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Aug 16, 2016·8 cites·18 claims
- 2089US10818635B2Fully molded semiconductor package for power devices and method of making the sameDECA TECHNOLOGIES INC·Filed 2019·Granted Oct 27, 2020·5 cites·19 claims
- 2188US11728248B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 2288US8826221B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Sep 2, 2014·7 cites·20 claims
- 2388US2025391814A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2487US11887862B2Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDLDECA TECH USA INC·Filed 2022·Granted Jan 30, 2024·1 cites·20 claims
- 2587US9269622B2Semiconductor device and method of land grid array packaging with bussing linesDECA TECHNOLOGIES INC·Filed 2013·Granted Feb 23, 2016·9 cites·20 claims
- 2687US8067821B1Flat semiconductor package with half package moldingCHOI YEONHO·Filed 2008·Granted Nov 29, 2011·25 cites·14 claims
- 2786US2025357351A1Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2885US9520331B2Adaptive patterning for panelized packagingDECA TECHNOLOGIES INC·Filed 2013·Granted Dec 13, 2016·5 cites·15 claims
- 2983US2025336888A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 3081US12362322B2Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2024·Granted Jul 15, 2025·0 cites·21 claims
- 3181US8072050B1Semiconductor device with increased I/O leadframe including passive deviceKARIM NOZAD O·Filed 2008·Granted Dec 6, 2011·14 cites·20 claims
- 3279US8333941B1Spray pyrolysis synthesis of mesoporous NbRuyOz as electrocatalyst supports in fuel cellsATANASSOV PLAMEN·Filed 2009·Granted Dec 18, 2012·6 cites·5 claims
- 3379US2025308993A1Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 3477US12438065B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2023·Granted Oct 7, 2025·0 cites·26 claims
- 3577US10056304B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2017·Granted Aug 21, 2018·3 cites·20 claims
- 3677US9640495B2Semiconductor device processing method for material removalDECA TECHNOLOGIES INC·Filed 2016·Granted May 2, 2017·3 cites·20 claims
- 3776US12469776B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 3875US12334396B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 3974US12381154B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 4074US12300561B2Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2024·Granted May 13, 2025·0 cites·21 claims
- 4173US2025372395A1EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAMEDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 4273US2024421051A1Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 4372US9401313B2Automated optical inspection of unit specific patterningDECA TECHNOLOGIES INC·Filed 2015·Granted Jul 26, 2016·2 cites·20 claims
- 4472US2025273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 4571US5841660AMethod and apparatus for modeling process controlMOTOROLA INC·Filed 1996·Granted Nov 24, 1998·44 cites·22 claims
- 4670US12424450B2Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the sameDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·0 cites·24 claims
- 4770US11791207B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 4870US11538759B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 27, 2022·0 cites·20 claims
- 4969US12057373B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 5068US12170261B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Dec 17, 2024·0 cites·30 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →