Inventor
KIM MYONGSEOB
US21 patents
⚠️ This page may combine multiple inventors who share the name “KIM MYONGSEOB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
17 patentsUS10770430B1Sep 8, 2020
Package integration for memory devices
XILINX INC53 citations97
US10692837B1Jun 23, 2020
Chip package assembly with modular core dice
XILINX INC35 citations93
US10529645B2Jan 7, 2020
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
XILINX INC26 citations93
US10262911B1Apr 16, 2019
Circuit for and method of testing bond connections between a first die and a second die
XILINX INC51 citations92
US11054461B1Jul 6, 2021
Test circuits for testing a die stack
XILINX INC12 citations84
US10431565B1Oct 1, 2019
Wafer edge partial die engineered for stacked die yield
XILINX INC10 citations84
US9412674B1Aug 9, 2016
Shielded wire arrangement for die testing
XILINX INC12 citations83
US8987009B1Mar 24, 2015
Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
XILINX INC8 citations83
US11901338B2Feb 13, 2024
Interwafer connection structure for coupling wafers in a wafer stack
XILINX INC2 citations73
US11205639B2Dec 21, 2021
Integrated circuit device with stacked dies having mirrored circuitry
XILINX INC2 citations73
US12557660B2Feb 17, 2026
Integrated circuit (IC) protections comprising electromagnetic radiation blocking material
XILINX INC0 citations62
US12068257B1Aug 20, 2024
Integrated circuit (IC) structure protection scheme
XILINX INC0 citations62
US11355412B2Jun 7, 2022
Stacked silicon package assembly having thermal management
XILINX INC1 citations62
US11114344B1Sep 7, 2021
IC die with dummy structures
XILINX INC1 citations62
US11114360B1Sep 7, 2021
Multi-die device structures and methods
XILINX INC0 citations62
US8810269B2Aug 19, 2014
Method of testing a semiconductor structure
XILINX INC3 citations60
US9236367B1Jan 12, 2016
Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
XILINX INC1 citations51