Inventor
LIU HENLEY
US23 patents
⚠️ This page may combine multiple inventors who share the name “LIU HENLEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XILINX INC
21 patentsUS10770430B1Sep 8, 2020
Package integration for memory devices
XILINX INC53 citations97
US10692837B1Jun 23, 2020
Chip package assembly with modular core dice
XILINX INC35 citations93
US10529645B2Jan 7, 2020
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
XILINX INC26 citations93
US10262911B1Apr 16, 2019
Circuit for and method of testing bond connections between a first die and a second die
XILINX INC51 citations92
US11054461B1Jul 6, 2021
Test circuits for testing a die stack
XILINX INC12 citations84
US10431565B1Oct 1, 2019
Wafer edge partial die engineered for stacked die yield
XILINX INC10 citations84
US9412674B1Aug 9, 2016
Shielded wire arrangement for die testing
XILINX INC12 citations83
US8354671B1Jan 15, 2013
Integrated circuit with adaptive VGG setting
XILINX INC11 citations83
US10720377B2Jul 21, 2020
Electronic device apparatus with multiple thermally conductive paths for heat dissipation
XILINX INC6 citations82
US11901338B2Feb 13, 2024
Interwafer connection structure for coupling wafers in a wafer stack
XILINX INC2 citations73
US11205639B2Dec 21, 2021
Integrated circuit device with stacked dies having mirrored circuitry
XILINX INC2 citations73
US10629512B2Apr 21, 2020
Integrated circuit die with in-chip heat sink
XILINX INC4 citations73
US10319606B1Jun 11, 2019
Chip package assembly with enhanced interconnects and method for fabricating the same
XILINX INC2 citations72
US12557660B2Feb 17, 2026
Integrated circuit (IC) protections comprising electromagnetic radiation blocking material
XILINX INC0 citations62
US12068257B1Aug 20, 2024
Integrated circuit (IC) structure protection scheme
XILINX INC0 citations62
US11355412B2Jun 7, 2022
Stacked silicon package assembly having thermal management
XILINX INC1 citations62
US11114344B1Sep 7, 2021
IC die with dummy structures
XILINX INC1 citations62
US8810269B2Aug 19, 2014
Method of testing a semiconductor structure
XILINX INC3 citations60
US10971474B1Apr 6, 2021
Package integration for high bandwidth memory
XILINX INC0 citations51
US10527670B2Jan 7, 2020
Testing system for lid-less integrated circuit packages
XILINX INC0 citations51
US10593638B2Mar 17, 2020
Methods of interconnect for high density 2.5D and 3D integration
XILINX INC0 citations41