Inventor
KOHARA GENE Y
US16 patents
⚠️ This page may combine multiple inventors who share the name “KOHARA GENE Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
14 patentsUS6919275B2Jul 19, 2005
Method of preventing diffusion of copper through a tantalum-comprising barrier layer
APPLIED MATERIALS INC87 citations99
US5985759ANov 16, 1999
Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers
APPLIED MATERIALS INC120 citations97
US7253109B2Aug 7, 2007
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
APPLIED MATERIALS INC44 citations96
US7074714B2Jul 11, 2006
Method of depositing a metal seed layer on semiconductor substrates
APPLIED MATERIALS INC26 citations96
US6758947B2Jul 6, 2004
Damage-free sculptured coating deposition
APPLIED MATERIALS INC47 citations96
US6271592B1Aug 7, 2001
Sputter deposited barrier layers
APPLIED MATERIALS INC104 citations96
US7381639B2Jun 3, 2008
Method of depositing a metal seed layer on semiconductor substrates
APPLIED MATERIALS INC10 citations93
US6110821AAug 29, 2000
Method for forming titanium silicide in situ
APPLIED MATERIALS INC37 citations92
US6620250B2Sep 16, 2003
Method and apparatus for shielding a device from a semiconductor wafer process chamber
APPLIED MATERIALS INC14 citations80
US7687909B2Mar 30, 2010
Metal / metal nitride barrier layer for semiconductor device applications
APPLIED MATERIALS INC7 citations74
US7989343B2Aug 2, 2011
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
APPLIED MATERIALS INC2 citations63
US7795138B2Sep 14, 2010
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
APPLIED MATERIALS INC2 citations63
US9991157B2Jun 5, 2018
Method for depositing a diffusion barrier layer and a metal conductive layer
APPLIED MATERIALS INC0 citations52
US7589016B2Sep 15, 2009
Method of depositing a sculptured copper seed layer
APPLIED MATERIALS INC0 citations52
CHIANG TONY
2 patentsUS9390970B2Jul 12, 2016
Method for depositing a diffusion barrier layer and a metal conductive layer
CHIANG TONY10 citations92
US8158511B2Apr 17, 2012
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features
CHIANG TONY1 citations62