Inventor · disambiguated record
Mamoru Mita
Also filed as: MITA MAMORU
28 granted patents·4 pending applications·660 citations·filing 1980–2014
97Inventor score
Top patents by PatentIndex Score
32 records- 0189US5886409AElectrode structure of wiring substrate of semiconductor device having expanded pitchHITACHI LTD·Filed 1997·Granted Mar 23, 1999·89 cites·19 claims
- 0288US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 0385US8101864B2Electronic device substrate and its fabrication method, and electronic device and its fabrication methodCHINDA AKIRA·Filed 2009·Granted Jan 24, 2012·13 cites·7 claims
- 0482US6433409B2Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating sameHITACHI CABLE·Filed 2001·Granted Aug 13, 2002·26 cites·10 claims
- 0582US6031292ASemiconductor device, interposer for semiconductor deviceHITACHI CABLE·Filed 1997·Granted Feb 29, 2000·66 cites·9 claims
- 0681US6297142B1Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloyHITACHI CABLE·Filed 2000·Granted Oct 2, 2001·26 cites·7 claims
- 0780US6426548B1Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating sameHITACHI CABLE·Filed 1998·Granted Jul 30, 2002·47 cites·14 claims
- 0875US8230591B2Method for fabricating an electronic device substrateCHINDA AKIRA·Filed 2008·Granted Jul 31, 2012·6 cites·14 claims
- 0972US7780836B2Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the sameHITACHI CABLE·Filed 2006·Granted Aug 24, 2010·5 cites·8 claims
- 1072US5837154AMethod of manufacturing double-sided circuit tape carrierHITACHI CABLE·Filed 1997·Granted Nov 17, 1998·45 cites·12 claims
- 1171US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 1270US5196725AHigh pin count and multi-layer wiring lead frameHITACHI CABLE·Filed 1991·Granted Mar 23, 1993·45 cites·13 claims
- 1369US6137185AElectrode structure of a wiring substrate of semiconductor device having expanded pitchHITACHI LTD·Filed 1999·Granted Oct 24, 2000·30 cites·16 claims
- 1467US7888697B2Lead frame, method of making the same and light receiving/emitting deviceHITACHI CABLE PREC CO LTD·Filed 2008·Granted Feb 15, 2011·7 cites·21 claims
- 1567US5866948AInterposer for semiconductor deviceHITACHI CABLE·Filed 1996·Granted Feb 2, 1999·31 cites·4 claims
- 1665US6433440B1Semiconductor device having a porous buffer layer for semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·24 cites·19 claims
- 1763US6323058B1Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor deviceHITACHI CABLE·Filed 1998·Granted Nov 27, 2001·27 cites·40 claims
- 1862US6049128ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Apr 11, 2000·21 cites·10 claims
- 1961US7202570B2Circuit tape having adhesive film semiconductor device and a method for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Apr 10, 2007·6 cites·23 claims
- 2061US6130112ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Oct 10, 2000·20 cites·7 claims
- 2159US6506627B1Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor deviceHITACHI CABLE·Filed 2000·Granted Jan 14, 2003·9 cites·28 claims
- 2257US2015093516A1Metal-film forming method, method for manufacturing a metal-film formed product and system for manufacturing the sameIBARAKI GIKEN LTD·Filed 2014·Application pending·0 cites
- 2351US7038325B2Wiring tape for semiconductor device including a buffer layer having interconnected foamsRENESAS TECH CORP·Filed 2004·Granted May 2, 2006·3 cites·9 claims
- 2450US5428889AMethod for manufacturing composite lead frameHITACHI CABLE·Filed 1992·Granted Jul 4, 1995·17 cites·8 claims
- 2547US2006225918A1Electronic device substrate and its fabrication method, and electronic device and its fabrication methodNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2646US6297073B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Oct 2, 2001·1 cites·8 claims
- 2745US4309959AApparatus for applying chemical plating to inner surfaces of tubular membersHITACHI LTD·Filed 1980·Granted Jan 12, 1982·10 cites·13 claims
- 2844US7268408B2Wiring board, method for manufacturing wiring board and electronic component using wiring boardHITACHI CABLE·Filed 2003·Granted Sep 11, 2007·2 cites·16 claims
- 2940US2002160185A1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameFiled 2002·Application pending·0 cites
- 3040US2002158343A1Semiconductor device and wiring tape for semiconductor deviceFiled 2002·Application pending·0 cites
- 3139US5326990AComposite lead frame with connected inner and outer leadsHITACHI CABLE·Filed 1992·Granted Jul 5, 1994·9 cites·4 claims
- 3232US5589668AMulti-metal layer wiring tab tape carrier and process for fabricating the sameHITACHI CABLE·Filed 1993·Granted Dec 31, 1996·7 cites·23 claims
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