Inventor
CHOI KEUNHO
KR7 patents
⚠️ This page may combine multiple inventors who share the name “CHOI KEUNHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS11315863B2Apr 26, 2022
Package substrate and method of manufacturing the package substrate, and semiconductor package including the package substrate and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations80
US11823995B2Nov 21, 2023
Package substrate, and semiconductor package including the package substrate
SAMSUNG ELECTRONICS CO LTD2 citations69
US12453104B2Oct 21, 2025
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations58
US11824043B2Nov 21, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41
US11626380B2Apr 11, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations41