Inventor

SIKKA KAMAL K

US83 patents

⚠️ This page may combine multiple inventors who share the name “SIKKA KAMAL K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SIKKA KAMAL K

IBM

Microjet module assembly

Microjet module assembly

Segmentation of a die stack for 3D packaging thermal management

Multi-chip package structures with discrete redistribution layers

Semiconductor microcooler

Thermally efficient semiconductor chip

Multi integrated circuit chip carrier package

Multichip module with stiffening frame and associated covers

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging

Cooling structure for electronic boards

Integrated circuit chip carrier with in-plane thermal conductance layer

Semiconductor microcooler

Cooling structure for electronic boards

Adjustable heat sink fin spacing

Adjustable heat sink fin spacing

Cooling structure for electronic boards

Determining magnitude of compressive loading

Multichip module with stiffening frame and associated covers

Semiconductor device assembly having a stress-relieving buffer layer

Apparatus and methods for cooling semiconductor integrated circuit package structures

Apparatus and methods for cooling semiconductor integrated circuit package structures

Chip package having chip extension and method

Lid edge capping load

Circuit substrate with mixed pitch wiring

Laminated stiffener to control the warpage of electronic chip carriers

Semiconductor wafer having trenches with varied dimensions for multi-chip modules

Electronic package cover having underside rib

Copper microcooler structure and fabrication

Copper microcooler structure and fabrication

Electronic package with tapered pedestal

Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages

Multiple chip bridge connector

Heat spreading layer with high thermal conductivity

Direct bonded heterogeneous integration packaging structures

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Rehealable and reworkable polymer for electronic packaging

Electronic package structure with offset stacked chips and top and bottom side cooling lid

Micro-fluidic channels having various critical dimensions

Semiconductor microcooler

Semiconductor microcooler

Adjustable heat sink fin spacing

Adjustable heat sink fin spacing

Cooling structure for electronic boards

Reduction of laminate failure in integrated circuit (IC) device carrier

Method of forming a flip-chip package

Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages

BARTLEY GERALD K

Enhanced thermal management of 3-D stacked die packaging

GLOBALFOUNDRIES INC

Thermal hot spot cooling for semiconductor devices

KADAKIA SURESH D

Multichip electronic packages and methods of manufacture