Inventor · disambiguated record
Richard P. Volant
Also filed as: VOLANT RICHARD · VOLANT RICHARD P · VOLANT RICHARD PAUL
99 granted patents·12 pending applications·2,101 citations·filing 1999–2016
99Inventor score
Top patents by PatentIndex Score
111 records- 0199US8563403B1Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation lastFAROOQ MUKTA G·Filed 2012·Granted Oct 22, 2013·184 cites·20 claims
- 0298US6621392B1Micro electromechanical switch having self-aligned spacersIBM·Filed 2002·Granted Sep 16, 2003·211 cites·20 claims
- 0397US6701779B2Perpendicular torsion micro-electromechanical switchIBM·Filed 2002·Granted Mar 9, 2004·82 cites·10 claims
- 0496US6635506B2Method of fabricating micro-electromechanical switches on CMOS compatible substratesIBM·Filed 2001·Granted Oct 21, 2003·155 cites·15 claims
- 0596US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 0695US8492878B2Metal-contamination-free through-substrate via structureFAROOQ MUKTA G·Filed 2010·Granted Jul 23, 2013·21 cites·24 claims
- 0795US8242604B2Coaxial through-silicon viaVOLANT RICHARD P·Filed 2009·Granted Aug 14, 2012·33 cites·13 claims
- 0894US8709936B2Method and structure of forming backside through silicon via connectionsVOLANT RICHARD P·Filed 2012·Granted Apr 29, 2014·15 cites·8 claims
- 0994US7670921B2Structure and method for self aligned vertical plate capacitorIBM·Filed 2006·Granted Mar 2, 2010·31 cites·12 claims
- 1094US7369911B1Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environmentIBM·Filed 2007·Granted May 6, 2008·65 cites·6 claims
- 1193US8394715B2Method of fabricating coaxial through-silicon viaVOLANT RICHARD P·Filed 2012·Granted Mar 12, 2013·16 cites·19 claims
- 1292US9401323B1Protected through semiconductor via (TSV)IBM·Filed 2015·Granted Jul 26, 2016·8 cites·10 claims
- 1392US7202764B2Noble metal contacts for micro-electromechanical switchesIBM·Filed 2003·Granted Apr 10, 2007·39 cites·13 claims
- 1491US6344125B1Pattern-sensitive electrolytic metal platingIBM·Filed 2000·Granted Feb 5, 2002·56 cites·20 claims
- 1589US8487425B2Optimized annular copper TSVANDRY PAUL S·Filed 2011·Granted Jul 16, 2013·9 cites·15 claims
- 1689US6425956B1Process for removing chemical mechanical polishing residual slurryIBM·Filed 2001·Granted Jul 30, 2002·44 cites·8 claims
- 1789US6383893B1Method of forming a crack stop structure and diffusion barrier in integrated circuitsIBM·Filed 2000·Granted May 7, 2002·62 cites·14 claims
- 1889US6368484B1Selective plating processIBM·Filed 2000·Granted Apr 9, 2002·56 cites·15 claims
- 1988US8691691B2TSV pillar as an interconnecting structureFAROOQ MUKTA G·Filed 2011·Granted Apr 8, 2014·10 cites·16 claims
- 2088US7638406B2Method of fabricating a high Q factor integrated circuit inductorIBM·Filed 2005·Granted Dec 29, 2009·13 cites·16 claims
- 2187US8546961B2Alignment marks to enable 3D integrationFAROOQ MUKTA G·Filed 2011·Granted Oct 1, 2013·9 cites·19 claims
- 2287US8114707B2Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chipFAROOQ MUKTA G·Filed 2010·Granted Feb 14, 2012·8 cites·20 claims
- 2387US7528048B2Planar vertical resistor and bond pad resistor and related methodIBM·Filed 2007·Granted May 5, 2009·12 cites·3 claims
- 2487US7256670B2Diaphragm activated micro-electromechanical switchIBM·Filed 2002·Granted Aug 14, 2007·32 cites·17 claims
- 2585US8658535B2Optimized annular copper TSVIBM·Filed 2013·Granted Feb 25, 2014·8 cites·11 claims
- 2685US7608909B2Suspended transmission line structures in back end of line processingIBM·Filed 2005·Granted Oct 27, 2009·12 cites·9 claims
- 2785US6819000B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2003·Granted Nov 16, 2004·28 cites·4 claims
- 2885US6800503B2MEMS encapsulated structure and method of making sameIBM·Filed 2002·Granted Oct 5, 2004·38 cites·31 claims
- 2985US6798029B2Method of fabricating micro-electromechanical switches on CMOS compatible substratesIBM·Filed 2003·Granted Sep 28, 2004·28 cites·11 claims
- 3085US6661069B1Micro-electromechanical varactor with enhanced tuning rangeIBM·Filed 2002·Granted Dec 9, 2003·48 cites·13 claims
- 3185US6414371B1Process and structure for 50+ gigahertz transistorIBM·Filed 2000·Granted Jul 2, 2002·38 cites·22 claims
- 3284US7622357B2Semiconductor device structures with backside contacts for improved heat dissipation and reduced parasitic resistanceIBM·Filed 2006·Granted Nov 24, 2009·13 cites·6 claims
- 3384US6597068B2Encapsulated metal structures for semiconductor devices and MIM capacitors including the sameIBM·Filed 2001·Granted Jul 22, 2003·27 cites·6 claims
- 3483US6979884B2Bipolar transistor having self-aligned silicide and a self-aligned emitter contact borderIBM·Filed 2003·Granted Dec 27, 2005·27 cites·10 claims
- 3583US6622507B2Electromechanical device and a process of preparing sameIBM·Filed 2001·Granted Sep 23, 2003·27 cites·16 claims
- 3683US6368953B1Encapsulated metal structures for semiconductor devices and MIM capacitors including the sameIBM·Filed 2000·Granted Apr 9, 2002·27 cites·4 claims
- 3781US9673095B2Protected through semiconductor via (TSV)IBM·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 3881US6992344B2Damascene integration scheme for developing metal-insulator-metal capacitorsIBM·Filed 2002·Granted Jan 31, 2006·24 cites·14 claims
- 3980US6834671B2Check valve for micro electro mechanical structure devicesIBM·Filed 2003·Granted Dec 28, 2004·19 cites·6 claims
- 4079US7480538B2Methods, systems, and computer program products for managing movement of work-in-process materials in an automated manufacturing environmentIBM·Filed 2007·Granted Jan 20, 2009·6 cites·14 claims
- 4179US6613641B1Production of metal insulator metal (MIM) structures using anodizing processIBM·Filed 2001·Granted Sep 2, 2003·19 cites·8 claims
- 4278US7005371B2Method of forming suspended transmission line structures in back end of line processingIBM·Filed 2004·Granted Feb 28, 2006·22 cites·10 claims
- 4378US6661098B2High density area array solder microjoining interconnect structure and fabrication methodIBM·Filed 2002·Granted Dec 9, 2003·18 cites·16 claims
- 4477US6927472B2Fuse structure and method to form the sameIBM·Filed 2001·Granted Aug 9, 2005·20 cites·15 claims
- 4577US6489857B2Multiposition micro electromechanical switchIBM·Filed 2000·Granted Dec 3, 2002·20 cites·10 claims
- 4676US8679971B2Metal-contamination-free through-substrate via structureIBM·Filed 2013·Granted Mar 25, 2014·3 cites·20 claims
- 4776US8159247B2Yield enhancement for stacked chips through rotationally-connecting-interposerGLUSCHENKOV OLEG·Filed 2009·Granted Apr 17, 2012·4 cites·15 claims
- 4876US7833893B2Method for forming conductive structuresIBM·Filed 2007·Granted Nov 16, 2010·5 cites·20 claims
- 4975US9040418B2Enhanced capture pads for through semiconductor viasIBM·Filed 2013·Granted May 26, 2015·3 cites·19 claims
- 5075US7855137B2Method of making a sidewall-protected metallic pillar on a semiconductor substrateIBM·Filed 2008·Granted Dec 21, 2010·6 cites·17 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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