P

Inventor

SPORRE JOHN R

US86 patents
⚠️ This page may combine multiple inventors who share the name “SPORRE JOHN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

44 patents
US9620590B1Apr 11, 2017

Nanosheet channel-to-source and drain isolation

IBM105 citations99
US9608065B1Mar 28, 2017

Air gap spacer for metal gates

IBM141 citations99
US9905643B1Feb 27, 2018

Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors

IBM28 citations94
US9741823B1Aug 22, 2017

Fin cut during replacement gate formation

IBM22 citations94
US9721848B1Aug 1, 2017

Cutting fins and gates in CMOS devices

IBM32 citations94
US9450095B1Sep 20, 2016

Single spacer for complementary metal oxide semiconductor process flow

IBM24 citations94
US9362179B1Jun 7, 2016

Method to form dual channel semiconductor material fins

IBM41 citations94
US9911914B1Mar 6, 2018

Sub-lithographic magnetic tunnel junctions for magnetic random access memory devices

IBM14 citations92
US9318574B2Apr 19, 2016

Method and structure for enabling high aspect ratio sacrificial gates

IBM16 citations92
US10615269B2Apr 7, 2020

Nanosheet channel-to-source and drain isolation

IBM5 citations84
US10249738B2Apr 2, 2019

Nanosheet channel-to-source and drain isolation

IBM6 citations84
US10242981B2Mar 26, 2019

Fin cut during replacement gate formation

IBM5 citations84
US10211055B2Feb 19, 2019

Fin patterns with varying spacing without fin cut

IBM7 citations84
US10074730B2Sep 11, 2018

Forming stacked nanowire semiconductor device

IBM11 citations84
US10043801B2Aug 7, 2018

Air gap spacer for metal gates

IBM5 citations84
US10014391B2Jul 3, 2018

Vertical transport field effect transistor with precise gate length definition

IBM10 citations84
US9923080B1Mar 20, 2018

Gate height control and ILD protection

IBM8 citations84
US9842739B2Dec 12, 2017

Method and structure for enabling high aspect ratio sacrificial gates

IBM8 citations84
US9786666B2Oct 10, 2017

Method to form dual channel semiconductor material fins

IBM5 citations84
US9728622B1Aug 8, 2017

Dummy gate formation using spacer pull down hardmask

IBM11 citations84
US9659779B2May 23, 2017

Method and structure for enabling high aspect ratio sacrificial gates

IBM7 citations84
US10229854B1Mar 12, 2019

FinFET gate cut after dummy gate removal

IBM11 citations83
US10049876B1Aug 14, 2018

Removal of trilayer resist without damage to underlying structure

IBM5 citations83
US10833190B2Nov 10, 2020

Super long channel device within VFET architecture

IBM4 citations73
US10741752B2Aug 11, 2020

Sub-lithographic magnetic tunnel junctions for magnetic random access memory devices

IBM1 citations73
US10658473B2May 19, 2020

Gate cut device fabrication with extended height gates

IBM1 citations73
US10629698B2Apr 21, 2020

Method and structure for enabling high aspect ratio sacrificial gates

IBM1 citations73
US10622352B2Apr 14, 2020

Fin cut to prevent replacement gate collapse on STI

IBM2 citations73
US10553581B2Feb 4, 2020

Air gap spacer for metal gates

IBM1 citations73
US10541308B2Jan 21, 2020

Gate cut device fabrication with extended height gates

IBM1 citations73
US10249762B2Apr 2, 2019

Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors

IBM2 citations73
US10249753B2Apr 2, 2019

Gate cut on a vertical field effect transistor with a defined-width inorganic mask

IBM4 citations73
US10224326B2Mar 5, 2019

Fin cut during replacement gate formation

IBM3 citations73
US10217634B2Feb 26, 2019

Fin patterns with varying spacing without fin cut

IBM1 citations73
US9997369B2Jun 12, 2018

Margin for fin cut using self-aligned triple patterning

IBM2 citations73
US9991117B2Jun 5, 2018

Fin patterns with varying spacing without fin cut

IBM2 citations73
US9984877B2May 29, 2018

Fin patterns with varying spacing without fin cut

IBM2 citations73
US9985138B2May 29, 2018

Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors

IBM2 citations73
US9893166B2Feb 13, 2018

Dummy gate formation using spacer pull down hardmask

IBM3 citations73
US9882048B2Jan 30, 2018

Gate cut on a vertical field effect transistor with a defined-width inorganic mask

IBM5 citations73
US9768075B1Sep 19, 2017

Method and structure to enable dual channel fin critical dimension control

IBM2 citations73
US9754942B2Sep 5, 2017

Single spacer for complementary metal oxide semiconductor process flow

IBM2 citations73
US9741856B2Aug 22, 2017

Stress retention in fins of fin field-effect transistors

IBM2 citations73
US9673199B1Jun 6, 2017

Gate cutting for a vertical transistor device

IBM3 citations73

TESSERA INC

2 patents

TESSERA LLC

2 patents

ADEIA SEMICONDUCTOR SOLUTIONS LLC

1 patent

GLOBALFOUNDRIES INC

1 patent

Showing the top 50 of 86 patents by PatentIndex Score.