Inventor
SPORRE JOHN R
US86 patents
⚠️ This page may combine multiple inventors who share the name “SPORRE JOHN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS9620590B1Apr 11, 2017
Nanosheet channel-to-source and drain isolation
IBM105 citations99
US9608065B1Mar 28, 2017
Air gap spacer for metal gates
IBM141 citations99
US9905643B1Feb 27, 2018
Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors
IBM28 citations94
US9741823B1Aug 22, 2017
Fin cut during replacement gate formation
IBM22 citations94
US9721848B1Aug 1, 2017
Cutting fins and gates in CMOS devices
IBM32 citations94
US9450095B1Sep 20, 2016
Single spacer for complementary metal oxide semiconductor process flow
IBM24 citations94
US9362179B1Jun 7, 2016
Method to form dual channel semiconductor material fins
IBM41 citations94
US9911914B1Mar 6, 2018
Sub-lithographic magnetic tunnel junctions for magnetic random access memory devices
IBM14 citations92
US9318574B2Apr 19, 2016
Method and structure for enabling high aspect ratio sacrificial gates
IBM16 citations92
US10615269B2Apr 7, 2020
Nanosheet channel-to-source and drain isolation
IBM5 citations84
US10249738B2Apr 2, 2019
Nanosheet channel-to-source and drain isolation
IBM6 citations84
US10242981B2Mar 26, 2019
Fin cut during replacement gate formation
IBM5 citations84
US10211055B2Feb 19, 2019
Fin patterns with varying spacing without fin cut
IBM7 citations84
US10074730B2Sep 11, 2018
Forming stacked nanowire semiconductor device
IBM11 citations84
US10043801B2Aug 7, 2018
Air gap spacer for metal gates
IBM5 citations84
US10014391B2Jul 3, 2018
Vertical transport field effect transistor with precise gate length definition
IBM10 citations84
US9923080B1Mar 20, 2018
Gate height control and ILD protection
IBM8 citations84
US9842739B2Dec 12, 2017
Method and structure for enabling high aspect ratio sacrificial gates
IBM8 citations84
US9786666B2Oct 10, 2017
Method to form dual channel semiconductor material fins
IBM5 citations84
US9728622B1Aug 8, 2017
Dummy gate formation using spacer pull down hardmask
IBM11 citations84
US9659779B2May 23, 2017
Method and structure for enabling high aspect ratio sacrificial gates
IBM7 citations84
US10229854B1Mar 12, 2019
FinFET gate cut after dummy gate removal
IBM11 citations83
US10049876B1Aug 14, 2018
Removal of trilayer resist without damage to underlying structure
IBM5 citations83
US10833190B2Nov 10, 2020
Super long channel device within VFET architecture
IBM4 citations73
US10741752B2Aug 11, 2020
Sub-lithographic magnetic tunnel junctions for magnetic random access memory devices
IBM1 citations73
US10658473B2May 19, 2020
Gate cut device fabrication with extended height gates
IBM1 citations73
US10629698B2Apr 21, 2020
Method and structure for enabling high aspect ratio sacrificial gates
IBM1 citations73
US10622352B2Apr 14, 2020
Fin cut to prevent replacement gate collapse on STI
IBM2 citations73
US10553581B2Feb 4, 2020
Air gap spacer for metal gates
IBM1 citations73
US10541308B2Jan 21, 2020
Gate cut device fabrication with extended height gates
IBM1 citations73
US10249762B2Apr 2, 2019
Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors
IBM2 citations73
US10249753B2Apr 2, 2019
Gate cut on a vertical field effect transistor with a defined-width inorganic mask
IBM4 citations73
US10224326B2Mar 5, 2019
Fin cut during replacement gate formation
IBM3 citations73
US10217634B2Feb 26, 2019
Fin patterns with varying spacing without fin cut
IBM1 citations73
US9997369B2Jun 12, 2018
Margin for fin cut using self-aligned triple patterning
IBM2 citations73
US9991117B2Jun 5, 2018
Fin patterns with varying spacing without fin cut
IBM2 citations73
US9984877B2May 29, 2018
Fin patterns with varying spacing without fin cut
IBM2 citations73
US9985138B2May 29, 2018
Vertically aligned nanowire channels with source/drain interconnects for nanosheet transistors
IBM2 citations73
US9893166B2Feb 13, 2018
Dummy gate formation using spacer pull down hardmask
IBM3 citations73
US9882048B2Jan 30, 2018
Gate cut on a vertical field effect transistor with a defined-width inorganic mask
IBM5 citations73
US9768075B1Sep 19, 2017
Method and structure to enable dual channel fin critical dimension control
IBM2 citations73
US9754942B2Sep 5, 2017
Single spacer for complementary metal oxide semiconductor process flow
IBM2 citations73
US9741856B2Aug 22, 2017
Stress retention in fins of fin field-effect transistors
IBM2 citations73
US9673199B1Jun 6, 2017
Gate cutting for a vertical transistor device
IBM3 citations73
TESSERA INC
2 patentsTESSERA LLC
2 patentsADEIA SEMICONDUCTOR SOLUTIONS LLC
1 patentGLOBALFOUNDRIES INC
1 patentShowing the top 50 of 86 patents by PatentIndex Score.