Inventor
INOUE HIROHARU
JP31 patents
⚠️ This page may combine multiple inventors who share the name “INOUE HIROHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC IP MAN CO LTD
17 patentsUS10371612B2Aug 6, 2019
Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material
PANASONIC IP MAN CO LTD2 citations72
US11066548B2Jul 20, 2021
Polyphenylene ether resin composition, prepreg, metal-clad laminate, and printed wiring board
PANASONIC IP MAN CO LTD2 citations71
US12098257B2Sep 24, 2024
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations61
US11905409B2Feb 20, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations61
US11365274B2Jun 21, 2022
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations61
US12122129B2Oct 22, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations59
US11945910B2Apr 2, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations59
US11234329B2Jan 25, 2022
Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board
PANASONIC IP MAN CO LTD0 citations59
US12173151B2Dec 24, 2024
Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board
PANASONIC IP MAN CO LTD0 citations58
US11866580B2Jan 9, 2024
Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board
PANASONIC IP MAN CO LTD0 citations58
US9585248B2Feb 28, 2017
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
PANASONIC IP MAN CO LTD0 citations52
US11059260B2Jul 13, 2021
Prepreg, metal-clad laminated board, and printed wiring board
PANASONIC IP MAN CO LTD0 citations51
US9795030B2Oct 17, 2017
Metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD0 citations51
US11407869B2Aug 9, 2022
Prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD0 citations48
US12275846B2Apr 15, 2025
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
PANASONIC IP MAN CO LTD0 citations42
US9894761B2Feb 13, 2018
Prepreg, metal-clad laminated plate and printed wiring board
PANASONIC IP MAN CO LTD0 citations41
US10543661B2Jan 28, 2020
Metal foil with resin, and metal-clad laminate and circuit board using same
PANASONIC IP MAN CO LTD0 citations39
NIPPON STEEL CORP
5 patentsUS4845185AJul 4, 1989
Soluble copolyimide from 9,9-bis (4-amino phenyl) fluorene
NIPPON STEEL CORP24 citations92
US4820868AApr 11, 1989
Process for preparation of naphthalene-2,6-dicarboxylic acid dialkali metal salts
NIPPON STEEL CORP9 citations72
US5006631AApr 9, 1991
Aromatic polyester carbonate from diphenol mixture
NIPPON STEEL CORP5 citations62
US4833214AMay 23, 1989
Soluble heat-resistant aromatic polyamide terminated with aromatic amido moieties
NIPPON STEEL CORP5 citations62
US4794159ADec 27, 1988
Heat-resistant polyamide from bis(4-aminophenyl)fluorene
NIPPON STEEL CORP6 citations62
PANASONIC CORP
5 patentsUS9736935B2Aug 15, 2017
Resin composition, resin varnish, prepreg, metal-clad laminated board and printed wiring board
PANASONIC CORP0 citations52
US9661749B2May 23, 2017
Metal-clad laminate and printed wiring board
PANASONIC CORP0 citations51
US9516746B2Dec 6, 2016
Metal-clad laminate and printed wiring board
PANASONIC CORP0 citations51
US9102850B2Aug 11, 2015
Prepreg, metal-clad laminate, and printed wiring board
PANASONIC CORP0 citations51
US9578734B2Feb 21, 2017
Prepreg, metal-clad laminate, and printed wiring board
PANASONIC CORP0 citations40