Metal-clad laminate and printed wiring board

Abstract

A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

The invention claimed is: 
     
       1. A metal-clad laminate comprising:
 an insulating layer, and a metal layer present on at least one surface side of the insulating layer, wherein 
 the insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer, 
 the center layer contains a cured product of a resin composition, and a fiber base material, 
 the first resin layer and the second resin layer are formed of cured products of resin compositions, respectively, 
 the resin composition in the center layer contains a thermosetting resin, 
 a resin contained in the resin composition in the center layer is different from resins contained in the resin compositions in the first resin layer and the second resin layer, and 
 a coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and a coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are between 10% and 70%, respectively, of a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer. 
 
     
     
       2. The metal-clad laminate according to  claim 1 , wherein the coefficient of thermal expansion of the cured product of the resin composition contained in the first resin layer and the coefficient of thermal expansion of the cured product of the resin composition contained in the second resin layer are between 3 ppm/° C. and 40 ppm/° C. in a temperature range of 40° C. to 125° C., respectively. 
     
     
       3. The metal-clad laminate according to  claim 1 , wherein the resin compositions of the first resin layer and the second resin layer are resin compositions containing a thermosetting compound containing an imide skeleton in a molecule. 
     
     
       4. The metal-clad laminate according to  claim 1 , wherein thicknesses of the first resin layer and the second resin layer are between 1 μm and 25 μm. 
     
     
       5. The metal-clad laminate according to  claim 1 , wherein a thickness of the insulating layer is between 20 μm and 250 μm. 
     
     
       6. The metal-clad laminate according to  claim 1 , wherein the resin composition in the center layer contains a radical polymerization type thermosetting compound. 
     
     
       7. The metal-clad laminate according to  claim 1 , wherein the resin composition in the center layer is a liquid resin composition. 
     
     
       8. The metal-clad laminate according to  claim 1 , wherein the metal layer is arranged on both surfaces of the insulating layer. 
     
     
       9. A printed wiring board obtained by forming a circuit by partially removing the metal layer of the metal-clad laminate according to  claim 1 .