Inventor
JIMAREZ MIGUEL A
US24 patents
Patents
24 patentsUS6497943B1Dec 24, 2002
Surface metal balancing to reduce chip carrier flexing
IBM162 citations99
US6204453B1Mar 20, 2001
Two signal one power plane circuit board
IBM173 citations98
US6583517B1Jun 24, 2003
Method and structure for joining two substrates with a low melt solder joint
IBM74 citations96
US5542601AAug 6, 1996
Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate
IBM145 citations94
US6955982B2Oct 18, 2005
Flip chip C4 extension structure and process
IBM29 citations92
US6818972B2Nov 16, 2004
Reduction of chip carrier flexing during thermal cycling
IBM16 citations92
US6757967B2Jul 6, 2004
Method of forming a chip assembly
IBM18 citations92
US6756680B2Jun 29, 2004
Flip chip C4 extension structure and process
IBM33 citations92
US6750405B1Jun 15, 2004
Two signal one power plane circuit board
IBM19 citations92
US6486415B2Nov 26, 2002
Compliant layer for encapsulated columns
IBM20 citations92
US6407334B1Jun 18, 2002
I/C chip assembly
IBM35 citations92
US6246124B1Jun 12, 2001
Encapsulated chip module and method of making same
IBM30 citations92
US6492600B1Dec 10, 2002
Laminate having plated microvia interconnects and method for forming the same
IBM28 citations91
US7353590B2Apr 8, 2008
Method of forming printed circuit card
IBM10 citations83
US6528179B1Mar 4, 2003
Reduction of chip carrier flexing during thermal cycling
IBM12 citations74
US6986198B2Jan 17, 2006
Method of forming printed circuit card
IBM6 citations73
US6558981B2May 6, 2003
Method for making an encapsulated semiconductor chip module
IBM7 citations73
US6524888B2Feb 25, 2003
Method of attaching a conformal chip carrier to a flip chip
IBM6 citations71
US6337509B2Jan 8, 2002
Fixture for attaching a conformal chip carrier to a flip chip
IBM7 citations71
US7278207B2Oct 9, 2007
Method of making an electronic package
IBM1 citations62
US6961995B2Nov 8, 2005
Method of making an electronic package
IBM3 citations62
US7328506B2Feb 12, 2008
Method for forming a plated microvia interconnect
IBM2 citations61
US6989607B2Jan 24, 2006
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers
IBM0 citations51
US6639302B2Oct 28, 2003
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries
IBM0 citations51