Inventor

STANDING MARTIN

AT88 patents

⚠️ This page may combine multiple inventors who share the name “STANDING MARTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STANDING MARTIN

INT RECTIFIER CORP

Semiconductor device package

Semiconductor package including two semiconductor die disposed within a common clip

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Semiconductor package

Wafer level underfill and interconnect process

Wafer level underfill and interconnect process

Wafer level insulation underfill for die attach

Conductive clip for a semiconductor package

Chip scale surface mounted device and process of manufacture

Surface mounted package with die bottom spaced from support board

Power semiconductor package

Paste for forming an interconnect and interconnect formed from the paste

Semiconductor device package utilizing proud interconnect material

Semiconductor device package utilizing proud interconnect material

Surface mounted package with die bottom spaced from support board

Semiconductor device having clips for connecting to external elements

Power semiconductor package

Solderable top metalization and passivation for source mounted package

Semiconductor package fabrication

Semiconductor device package

Semiconductor package

Flip-chip device having conductive connectors

Chip scale surface mounted device and process of manufacture

Chip scale surface mounted device and process of manufacture

Power semiconductor package with multiple dies

Semiconductor package

High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing

Semiconductor package

STANDING MARTIN

Electronic module

Semiconductor packages and methods of forming the same

Semiconductor device and passive component integration in a semiconductor package

Semiconductor package

Embedded laminated device

Power semiconductor package

Power semiconductor package

Vertically mountable semiconductor device package

Multi-phase voltage regulation module

Process of fabricating a semiconductor package

INFINEON TECHNOLOGIES AMERICAS CORP

Semiconductor package with integrated semiconductor devices and passive component

Passive component integrated with semiconductor device in semiconductor package

Semiconductor package with integrated semiconductor devices and passive component

Power semiconductor package

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

FARADAY SEMI INC

Electrical devices and methods of manufacture

Electrical devices and methods of manufacture

INFINEON TECHNOLOGIES AUSTRIA AG

System and method of providing a semiconductor carrier and redistribution structure

Electronic component and method for electrically coupling a semiconductor die to a contact pad