Inventor

FUKASE KATSUYA

JP41 patents

⚠️ This page may combine multiple inventors who share the name “FUKASE KATSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKASE KATSUYA

SHINKO ELECTRIC IND CO

Lead frame and method for manufacturing same

Lead frame and method for manufacturing same

Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions

Semiconductor device and lead frame used therein

Interposer, method of fabricating the same, and semiconductor device using the same

Transfer sheet and process for making a circuit substrate

Process for forming a circuit substrate

Wiring board and method of manufacturing wiring board

Wiring substrate and manufacturing method of wiring substrate

Wiring substrate

Wiring board

Wiring substrate and semiconductor device

Wiring substrate and method for manufacturing the same

Automatic bonding tape used in semiconductor device

Automatic bonding tape used in semiconductor device

Wiring substrate and semiconductor package

Wiring substrate and method of manufacturing the same

Lead frame and method for manufacturing same

Wiring board having two insulating films and hole penetrating therethrough

Method of forming metal plate pattern and circuit board

Process for making circuit board or lead frame

Circuit board manufacturing method and circuit board

Electronic component-embedded substrate and electronic component device

Electronic component-embedded board and electronic component device

Carrier base material-added wiring substrate

Wiring substrate and semiconductor device

Careless wiring substrate having an insulation layer with a bulged covering portion and semiconductor device thereof

Electronic component-embedded board

Multi-layer substrate and method for manufacturing multi-layer substrate

Carrier base material-added wiring substrate

Wiring board and semiconductor device

Wiring board

Wiring substrate and semiconductor device

Circuit board and method of manufacturing circuit board

Method of manufacturing wiring substrate

Wiring substrate and manufacturing method of wiring substrate

YOKOUCHI KISHIO

Circuit board and method of manufacturing the same

Circuit board and method of manufacturing the same

KANEDA YASUO

Method for forming resist pattern, method for producing circuit board, and circuit board

YAMASAKI TOMOO

Manufacturing method of wiring board

FUKASE KATSUYA

Method of manufacturing a wiring substrate