Electronic component-embedded substrate and electronic component device

Abstract

An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged on a part of the support pattern in the cavity and formed of the same material as the core substrate, a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas, and an insulating material filling an inside of the cavity.

What is claimed is: 
     
       1. An electronic component-embedded substrate comprising:
 a core substrate; 
 a cavity penetrating the core substrate; 
 a wiring layer formed on one surface of the core substrate; 
 a support pattern bridging over the cavity and directly contacting opposed edges of the core substrate defining the cavity, the support pattern configured to divide the cavity into a plurality of component embedding areas; 
 an insulation wall portion arranged on only part of the support pattern in the cavity, with another part of the support pattern in the cavity being exposed from the insulation wall portion, the insulation wall portion being disposed in the cavity, the insulation wall portion being formed of a same material as the core substrate; 
 a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas; and 
 an insulating material filling an inside of the cavity. 
 
     
     
       2. The electronic component-embedded substrate according to  claim 1 , wherein the support pattern is formed of a same layer as the wiring layer. 
     
     
       3. The electronic component-embedded substrate according to  claim 1 , wherein the insulation wall portion comprises an island-shaped wall portion separated from the core substrate. 
     
     
       4. The electronic component-embedded substrate according to  claim 3 , wherein the support pattern has an intersection part at which a plurality of band-shaped patterns intersects, and
 wherein the island-shaped wall portion is a cross-shaped wall portion arranged on the intersection part. 
 
     
     
       5. The electronic component-embedded substrate according to  claim 1 , wherein the insulation wall portion comprises a protrusion wall portion protruding inward from the core substrate towards the cavity. 
     
     
       6. The electronic component-embedded substrate according to  claim 1 , wherein a width of the insulation wall portion is greater than a width of the support pattern. 
     
     
       7. The electronic component-embedded substrate according to  claim 1 , further comprising:
 via-holes formed in the insulating material and reaching one surfaces of connection terminals of the electronic components; and 
 a wiring layer formed on one surface of the insulating material and connected to one surfaces of the connection terminals of the electronic components through the via-holes. 
 
     
     
       8. The electronic component-embedded substrate according to  claim 1 , wherein the support pattern and the wiring layer are made of a same material. 
     
     
       9. An electronic component device comprising:
 an electronic component-embedded substrate including
 a core substrate, 
 a cavity penetrating the core substrate, 
 a wiring layer formed on one surface of the core substrate, 
 a support pattern bridging over the cavity and directly contacting opposed edges of the core substrate defining the cavity, the support pattern configured to divide the cavity into a plurality of component embedding areas, 
 an insulation wall portion arranged on only part of the support pattern in the cavity, with another part of the support pattern in the cavity being exposed from the insulation wall portion, the insulation wall portion being disposed in the cavity, and the insulation wall portion being formed of a same material as the core substrate, 
 a plurality of first electronic components each of which is mounted in each of the plurality of component embedding areas, and 
 an insulating material filling an inside of the cavity; and 
 
 a second electronic component mounted on the electronic component-embedded substrate and electrically connected to at least one of the first electronic components. 
 
     
     
       10. The electronic component device according to  claim 9 , wherein the support pattern is formed of a same layer as the wiring layer. 
     
     
       11. The electronic component device according to  claim 9 , wherein the support pattern and the wiring layer are made of a same material.