Inventor · disambiguated record
Katsuya Fukase
Also filed as: FUKASE KATSUYA
41 granted patents·3 pending applications·592 citations·filing 1988–2019
97Inventor score
Top patents by PatentIndex Score
44 records- 0197US7388293B2Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructionsSHINKO ELECTRIC IND CO·Filed 2005·Granted Jun 17, 2008·64 cites·10 claims
- 0295US7415762B2Interposer, method of fabricating the same, and semiconductor device using the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 26, 2008·38 cites·3 claims
- 0395US5643433ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1993·Granted Jul 1, 1997·162 cites·7 claims
- 0492US5909053ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1996·Granted Jun 1, 1999·111 cites·4 claims
- 0589US9232657B2Wiring substrate and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Jan 5, 2016·13 cites·6 claims
- 0686US9313904B2Wiring board and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 12, 2016·8 cites·6 claims
- 0781US5293301ASemiconductor device and lead frame used thereinSHINKO ELECTRIC IND CO·Filed 1991·Granted Mar 8, 1994·69 cites·4 claims
- 0878US9961785B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted May 1, 2018·3 cites·9 claims
- 0978US9253897B2Wiring substrate and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 2, 2016·3 cites·14 claims
- 1077US10707178B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2019·Granted Jul 7, 2020·2 cites·8 claims
- 1176US10398027B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2018·Granted Aug 27, 2019·2 cites·10 claims
- 1273US9433109B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2014·Granted Aug 30, 2016·2 cites·7 claims
- 1373US8143533B2Method for forming resist pattern, method for producing circuit board, and circuit boardKANEDA YASUO·Filed 2006·Granted Mar 27, 2012·9 cites·4 claims
- 1470US11152293B2Wiring board having two insulating films and hole penetrating therethroughSHINKO ELECTRIC IND CO·Filed 2019·Granted Oct 19, 2021·1 cites·8 claims
- 1569US7999193B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 16, 2011·3 cites·14 claims
- 1669US4969257ATransfer sheet and process for making a circuit substrateSHINKO ELECTRIC IND CO·Filed 1988·Granted Nov 13, 1990·24 cites·16 claims
- 1769US4867839AProcess for forming a circuit substrateSHINKO ELECTRIC IND CO·Filed 1988·Granted Sep 19, 1989·35 cites·14 claims
- 1867US8161636B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted Apr 24, 2012·3 cites·5 claims
- 1967US7454832B2Method of forming metal plate pattern and circuit boardSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 25, 2008·4 cites·14 claims
- 2066US8186053B2Circuit board and method of manufacturing the sameYOKOUCHI KISHIO·Filed 2008·Granted May 29, 2012·4 cites·5 claims
- 2160US7679004B2Circuit board manufacturing method and circuit boardSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 16, 2010·2 cites·3 claims
- 2256US8066862B2Manufacturing method of wiring boardYAMASAKI TOMOO·Filed 2008·Granted Nov 29, 2011·1 cites·3 claims
- 2354US8166648B2Method of manufacturing a wiring substrateFUKASE KATSUYA·Filed 2009·Granted May 1, 2012·1 cites·5 claims
- 2449US9313894B2Wiring substrate and manufacturing method of wiring substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 12, 2016·0 cites·6 claims
- 2547US11289403B2Multi-layer substrate and method for manufacturing multi-layer substrateSHINKO ELECTRIC IND CO·Filed 2019·Granted Mar 29, 2022·0 cites·12 claims
- 2647US10510638B2Electronic component-embedded boardSHINKO ELECTRIC IND CO·Filed 2018·Granted Dec 17, 2019·0 cites·9 claims
- 2747US5183711AAutomatic bonding tape used in semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1991·Granted Feb 2, 1993·16 cites·9 claims
- 2847US2018047661A1Wiring boardSHINKO ELECTRIC IND CO·Filed 2017·Application pending·0 cites
- 2946US9905504B1Carrier base material-added wiring substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Feb 27, 2018·0 cites·7 claims
- 3045US10321574B2Electronic component-embedded substrate and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Jun 11, 2019·0 cites·11 claims
- 3145US7005241B2Process for making circuit board or lead frameSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 28, 2006·2 cites·19 claims
- 3244US10080293B2Electronic component-embedded board and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Sep 18, 2018·0 cites·11 claims
- 3344US9420696B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2014·Granted Aug 16, 2016·0 cites·8 claims
- 3444US2007017090A1Method of forming metal plate pattern and circuit boardSAKAI TOYOAKI·Filed 2006·Application pending·0 cites
- 3543US10892217B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted Jan 12, 2021·0 cites·7 claims
- 3643US9799595B2Careless wiring substrate having an insulation layer with a bulged covering portion and semiconductor device thereofSHINKO ELECTRIC IND CO·Filed 2016·Granted Oct 24, 2017·0 cites·7 claims
- 3742US10109580B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Oct 23, 2018·0 cites·7 claims
- 3840US10340214B2Carrier base material-added wiring substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Jul 2, 2019·0 cites·5 claims
- 3940US10080292B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2017·Granted Sep 18, 2018·0 cites·6 claims
- 4038US2005124091A1Process for making circuit board or lead frameSHINKO ELECTRIC IND CO·Filed 2004·Application pending·0 cites
- 4136US5087530AAutomatic bonding tape used in semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1989·Granted Feb 11, 1992·7 cites·10 claims
- 4234US9966331B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted May 8, 2018·0 cites·10 claims
- 4334US9961767B2Circuit board and method of manufacturing circuit boardSHINKO ELECTRIC IND CO·Filed 2016·Granted May 1, 2018·0 cites·18 claims
- 4434US5656855ALead frame and method for manufacturing sameSHINKO ELECTRIC IND CO·Filed 1995·Granted Aug 12, 1997·3 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →