Inventor
HAIBARA TERUO
JP37 patents
⚠️ This page may combine multiple inventors who share the name “HAIBARA TERUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON MICROMETAL CORP
25 patentsUS10137534B2Nov 27, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP5 citations84
US9887172B2Feb 6, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP6 citations83
US10737356B2Aug 11, 2020
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US10610976B2Apr 7, 2020
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US10414002B2Sep 17, 2019
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP1 citations73
US9543266B2Jan 10, 2017
Bonding wire for semiconductor device use and method of production of same
NIPPON MICROMETAL CORP2 citations73
US12090578B2Sep 17, 2024
Al bonding wire
NIPPON MICROMETAL CORP2 citations72
US11373934B2Jun 28, 2022
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP4 citations72
US12532767B2Jan 20, 2026
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12388044B2Aug 12, 2025
Al bonding wire
NIPPON MICROMETAL CORP0 citations62
US12300658B2May 13, 2025
Copper alloy bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations62
US12132025B2Oct 29, 2024
Bonding wire
NIPPON MICROMETAL CORP0 citations62
US11929343B2Mar 12, 2024
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP1 citations62
US11721660B2Aug 8, 2023
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP1 citations62
US11101234B2Aug 24, 2021
Cu pillar cylindrical preform for semiconductor connection
NIPPON MICROMETAL CORP0 citations62
US12412864B2Sep 9, 2025
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations60
US11342299B2May 24, 2022
Bonding wire for semiconductor devices
NIPPON MICROMETAL CORP0 citations60
US12463172B2Nov 4, 2025
AG alloy bonding wire for semiconductor devices and semiconductor device
NIPPON MICROMETAL CORP0 citations59
US10672733B2Jun 2, 2020
Cu alloy core bonding wire with Pd coating for semiconductor device
NIPPON MICROMETAL CORP0 citations52
US10497663B2Dec 3, 2019
Cu alloy core bonding wire with Pd coating for semiconductor device
NIPPON MICROMETAL CORP0 citations52
US10236272B2Mar 19, 2019
Cu alloy core bonding wire with Pd coating for semiconductor device
NIPPON MICROMETAL CORP0 citations52
US9536854B2Jan 3, 2017
Bonding wire for semiconductor device use and method of production of same
NIPPON MICROMETAL CORP0 citations52
US10121758B2Nov 6, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP0 citations51
US10121764B2Nov 6, 2018
Method for forming ball in bonding wire
NIPPON MICROMETAL CORP0 citations51
US10032741B2Jul 24, 2018
Bonding wire for semiconductor device
NIPPON MICROMETAL CORP0 citations51
SILTRONIC AG
6 patentsUS7276168B2Oct 2, 2007
Method for supply of constant-concentration ozonated water
SILTRONIC AG11 citations78
US9773688B2Sep 26, 2017
Ultrasonic cleaning method and ultrasonic cleaning apparatus
SILTRONIC AG3 citations70
US8043435B2Oct 25, 2011
Cleaning liquid and cleaning method for electronic material
SILTRONIC AG2 citations62
US10137483B2Nov 27, 2018
Ultrasonic cleaning method
SILTRONIC AG0 citations49
US9662687B2May 30, 2017
Ultrasonic cleaning method
SILTRONIC AG0 citations49
US9457385B2Oct 4, 2016
Ultrasonic cleaning method and ultrasonic cleaning apparatus
SILTRONIC AG1 citations49
HAIBARA TERUO
4 patentsUS8575571B2Nov 5, 2013
Cleaning apparatus, measurement method and calibration method
HAIBARA TERUO2 citations58
US8408221B2Apr 2, 2013
Micro bubble generating device and silicon wafer cleaning apparatus
HAIBARA TERUO0 citations50
US8778085B2Jul 15, 2014
Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus
HAIBARA TERUO0 citations47
US10121649B2Nov 6, 2018
Cleaning method of semiconductor wafer
HAIBARA TERUO0 citations39