Inventor
CHEN SHING-CHAO
TW22 patents
Patents
22 patentsUS11177156B2Nov 16, 2021
Semiconductor package, manufacturing method of semiconductor device and semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations85
US11088124B2Aug 10, 2021
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10128193B2Nov 13, 2018
Package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9425178B2Aug 23, 2016
RDL-first packaging process
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations84
US11404381B2Aug 2, 2022
Chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10950572B2Mar 16, 2021
Die bonder and methods of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10797038B2Oct 6, 2020
Semiconductor package and rework process for the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10515900B2Dec 24, 2019
Chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10475764B2Nov 12, 2019
Die bonder and methods of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10157846B2Dec 18, 2018
Method for forming chip package involving cutting process
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12444719B2Oct 14, 2025
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322640B2Jun 3, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125797B2Oct 22, 2024
Package structure with fan-out feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080653B2Sep 3, 2024
Formation method of chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12033992B2Jul 9, 2024
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776838B2Oct 3, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10964663B2Mar 30, 2021
Die bonder and methods of using the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867953B2Dec 15, 2020
Manufacturing method of integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10840111B2Nov 17, 2020
Chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10283470B2May 7, 2019
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10276537B2Apr 30, 2019
Integrated fan-out package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9947552B2Apr 17, 2018
Structure and formation method of chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52