Inventor · disambiguated record
Tung-Yao Kuo
Also filed as: KUO TUNG-YAO
5 granted patents·2 pending applications·10 citations·filing 2008–2022
71Inventor score
Top patents by PatentIndex Score
7 records- 0176US11476204B2Flip-chip packaging substrate and method for fabricating the samePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2019·Granted Oct 18, 2022·2 cites·3 claims
- 0269US7799603B2Method for mounting electronic component on printed circuit boardFOXCONN ADVANCED TECH INC·Filed 2009·Granted Sep 21, 2010·4 cites·2 claims
- 0366US12154866B2Method of fabricating a flip-chip package core substrate with build-up layersPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·2 claims
- 0465US8067696B2Printed circuit board and method for manufacturing sameTSAI CHUNG-JEN·Filed 2009·Granted Nov 29, 2011·3 cites·12 claims
- 0564US10483232B2Method for fabricating bump structures on chips with panel type processPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·12 claims
- 0639US2009056624A1Fluid circulating system for manufacturing printed circuit boardFOXCONN ADVANCED TECH INC·Filed 2008·Application pending·0 cites
- 0736US2011284162A1Apparatus for wet processing substrateCai zong-qing·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →