Inventor

KWON WOON-SEONG

US60 patents

⚠️ This page may combine multiple inventors who share the name “KWON WOON-SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KWON WOON-SEONG

GOOGLE LLC

Cooling electronic devices in a data center

Methods and heat distribution devices for thermal management of chip assemblies

Cooling electronic devices in a data center

Package stiffener for protecting semiconductor die

Cooling electronic devices in a data center

Cooling electronic devices in a data center

High bandwidth memory package for high performance processors

Backside integrated voltage regulator for integrated circuits

Embedded air gap transmission lines

Methods and heat distribution devices for thermal management of chip assemblies

Deep trench capacitors embedded in package substrate

Three dimensional IC package with thermal enhancement

Backside integrated voltage regulator for integrated circuits

ASIC package with photonics and vertical power delivery

Integrated circuit package for high bandwidth memory

Structure for optimal XPU socket compression

Methods and heat distribution devices for thermal management of chip assemblies

Backside integrated voltage regulator for integrated circuits

Backside interconnection interface die for integrated circuits package

Integrated circuit package for high bandwidth memory

ASIC package with photonics and vertical power delivery

Three dimensional IC package with thermal enhancement

Backside integrated voltage regulator for integrated circuits

Integrated circuit package for high bandwidth memory

ASIC package with photonics and vertical power delivery

Integrated circuit substrate for containing liquid adhesive bleed-out

Wafer level fan-out application specific integrated circuit bridge memory stack

Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications

High bandwidth memory package for high performance processors

Package stiffener for protecting semiconductor die

Methods and heat distribution devices for thermal management of chip assemblies

XILINX INC

Multi-die integrated circuits implemented using spacer dies

Semiconductor assembly having bridge module for die-to-die interconnection

Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product

Warpage management for fan-out mold packaged integrated circuit

Interposer with edge reinforcement and method for manufacturing same

Integrated circuit package with multi-trench structure on flipped substrate contacting underfill

Solder bump structure with enhanced high temperature aging reliability and method for manufacturing same

Techniques for molded underfill for integrated circuit dies

SAMSUNG ELECTRONICS CO LTD

Camera module and electronic apparatus having the same

Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

Stack type semiconductor chip package having different type of chips and fabrication method thereof

KWON WOON-SEONG

Methods for flip chip stacking

Methods for flip chip stacking

Camera modules and methods of fabricating the same

GOOGLE INC

Integration of silicon photonics IC for high data rate

Protective barrier for integrated circuit packages housing a voltage regulator and a load

KOREA ADVANCED INST SCI & TECH

Method for manufacturing conductive adhesive for high frequency flip chip package applications

KWON WOON SEONG

Method of processing a wafer