Inventor · disambiguated record
Kuei-Wu Huang
Also filed as: HUANG KUEI-WU
28 granted patents·8 pending applications·456 citations·filing 1991–2017
97Inventor score
Files withSGS THOMSON MICROELECTRONICS9TAIWAN SEMICONDUCTOR MFG9ST MICROELECTRONICS INC6GINTECH ENERGY CORP5WANG CHEN-CHAN2
Top patents by PatentIndex Score
36 records- 0187US6130151AMethod of manufacturing air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 10, 2000·83 cites·35 claims
- 0287US5682055AMethod of forming planarized structures in an integrated circuitSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Oct 28, 1997·62 cites·14 claims
- 0376US5640023ASpacer-type thin-film polysilicon transistor for low-power memory devicesSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Jun 17, 1997·30 cites·6 claims
- 0473US6746900B1Method for forming a semiconductor device having high-K gate dielectric materialTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 8, 2004·17 cites·25 claims
- 0569US6472719B1Method of manufacturing air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 29, 2002·14 cites·2 claims
- 0667US5804472AMethod of making spacer-type thin-film polysilicon transistor for low-power memory devicesST MICROELECTRONICS INC·Filed 1996·Granted Sep 8, 1998·20 cites·49 claims
- 0764US6617638B2Tapered floating gate with nitride spacers to prevent reverse tunneling during programming in a split gate flashTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Sep 9, 2003·18 cites·5 claims
- 0863US7271103B2Surface treated low-k dielectric as diffusion barrier for copper metallizationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 18, 2007·8 cites·12 claims
- 0963US6162691AMethod for forming a MOSFET with raised source and drain, saliciding, and removing upper portion of gate spacers if bridging occursTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Dec 19, 2000·21 cites·21 claims
- 1062US9748433B1Method for recovering efficacy of solar cell module and portable device thereofGINTECH ENERGY CORP·Filed 2016·Granted Aug 29, 2017·1 cites·3 claims
- 1162US5350486ASemiconductor planarization processSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Sep 27, 1994·25 cites·15 claims
- 1261US9514965B2Substrate surface metallization method and substrate having metallized surface manufactured by the sameNAT UNIV TSING HUA·Filed 2015·Granted Dec 6, 2016·1 cites·9 claims
- 1361US6180509B1Method for forming planarized multilevel metallization in an integrated circuitST MICROELECTRONICS INC·Filed 1997·Granted Jan 30, 2001·24 cites·31 claims
- 1456US8685784B2Conductive channel of photovoltaic panel and method for manufacturing the sameWANG CHEN-CHAN·Filed 2012·Granted Apr 1, 2014·0 cites·3 claims
- 1556US5437763AMethod for formation of contact vias in integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Aug 1, 1995·20 cites·21 claims
- 1655US6232203B1Process for making improved shallow trench isolation by employing nitride spacers in the formation of the trenchesTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 15, 2001·20 cites·22 claims
- 1754US5485035AMethod for planarization of an integrated circuitSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Jan 16, 1996·23 cites·9 claims
- 1849US8420941B2Conductive channel of photovoltaic panel and method for manufacturing the sameWANG CHEN-CHAN·Filed 2010·Granted Apr 16, 2013·0 cites·4 claims
- 1949US2012255592A1Photovoltaic panel and manufacturing method thereofCHANG KAI-SHENG·Filed 2011·Application pending·0 cites
- 2048US6200860B1Process for preventing the reverse tunneling during programming in split gate flashTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Mar 13, 2001·13 cites·16 claims
- 2148US6191484B1Method of forming planarized multilevel metallization in an integrated circuitST MICROELECTRONICS INC·Filed 1995·Granted Feb 20, 2001·13 cites·20 claims
- 2247US6580133B2Contact in an integrated circuitST MICROELECTRONICS INC·Filed 2001·Granted Jun 17, 2003·2 cites·20 claims
- 2346US5300797ACoplanar twin-well integrated circuit structureSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Apr 5, 1994·14 cites·25 claims
- 2446US2013056055A1Solar energy cellHUANG KUEI-WU·Filed 2011·Application pending·0 cites
- 2543US6297110B1Method of forming a contact in an integrated circuitST MICROELECTRONICS INC·Filed 1994·Granted Oct 2, 2001·11 cites·30 claims
- 2642US5245213APlanarized semiconductor productSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Sep 14, 1993·10 cites·4 claims
- 2742US2017330992A1Method for recovering efficacy of solar cell module and portable device thereofGINTECH ENERGY CORP·Filed 2017·Application pending·0 cites
- 2841US8647917B2Method of manufacturing solar cellCHIOU YAN-KAI·Filed 2011·Granted Feb 11, 2014·0 cites·8 claims
- 2936US2003071306A1Method of forming planarized structures in an integrated circuitFiled 2000·Application pending·0 cites
- 3036US2002149085A1Method of manufacturing air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 3135US5384483APlanarizing glass layer spaced from via holesSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Jan 24, 1995·5 cites·10 claims
- 3230USRE41068ESpacer-type thin-film polysilicon transistor for low-power memory devicesST MICROELECTRONICS INC·Filed 1999·Granted Jan 5, 2010·0 cites·24 claims
- 3330US5200880AMethod for forming interconnect for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Apr 6, 1993·1 cites·39 claims
- 3430US2017025554A1Solar cellGINTECH ENERGY CORP·Filed 2015·Application pending·0 cites
- 3529US2017330991A1Method of hydrogenating solar cell and the device thereofGINTECH ENERGY CORP·Filed 2016·Application pending·0 cites
- 3629US2016118510A1Solar cell and method for manufacturing the sameGINTECH ENERGY CORP·Filed 2015·Application pending·0 cites
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