Inventor
KWON JAE DOO
KR6 patents
⚠️ This page may combine multiple inventors who share the name “KWON JAE DOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
4 patentsUS10049954B2Aug 14, 2018
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECHNOLOGY INC7 citations83
US10685897B2Jun 16, 2020
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECHNOLOGY INC2 citations72
US9054089B2Jun 9, 2015
Lead frame package having discharge holes and method of manufacturing the same
AMKOR TECHNOLOGY INC2 citations62
US9633932B2Apr 25, 2017
Lead frame package having discharge hole and method of manufacturing the same
AMKOR TECHNOLOGY INC0 citations51
AMKOR TECH SINGAPORE HOLDING PTE LTD
2 patentsUS11508635B2Nov 22, 2022
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations72
US12062588B2Aug 13, 2024
Semiconductor package having routable encapsulated conductive substrate and method
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62