P

Inventor

LIM HAN JIN

KR55 patents
⚠️ This page may combine multiple inventors who share the name “LIM HAN JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

44 patents
US7271055B2Sep 18, 2007

Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitors

SAMSUNG ELECTRONICS CO LTD26 citations92
US6284589B1Sep 4, 2001

Method of fabricating concave capacitor including adhesion spacer

SAMSUNG ELECTRONICS CO LTD30 citations92
US6583056B2Jun 24, 2003

Storage electrode of a semiconductor memory device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD19 citations90
US11322578B2May 3, 2022

Semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations84
US10403638B2Sep 3, 2019

Vertical memory devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations84
US9716094B2Jul 25, 2017

Semiconductor device having capacitor and method of fabricating the semiconductor device

SAMSUNG ELECTRONICS CO LTD7 citations84
US9362422B2Jun 7, 2016

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD15 citations84
US10325992B2Jun 18, 2019

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD4 citations83
US9041122B2May 26, 2015

Semiconductor devices having metal silicide layers and methods of manufacturing such semiconductor devices

SAMSUNG ELECTRONICS CO LTD16 citations83
US6930013B2Aug 16, 2005

Method of forming a capacitor of an integrated circuit device

SAMSUNG ELECTRONICS CO LTD19 citations83
US9455259B2Sep 27, 2016

Semiconductor devices including diffusion barriers with high electronegativity metals

SAMSUNG ELECTRONICS CO LTD11 citations82
US8012823B2Sep 6, 2011

Methods of fabricating stack type capacitors of semiconductor devices

SAMSUNG ELECTRONICS CO LTD8 citations82
US9437420B2Sep 6, 2016

Capacitors including amorphous dielectric layers and methods of forming the same

SAMSUNG ELECTRONICS CO LTD10 citations81
US7049232B2May 23, 2006

Methods for forming ruthenium films with β-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US6743678B2Jun 1, 2004

Methods for manufacturing semiconductor memory devices

SAMSUNG ELECTRONICS CO LTD11 citations74
US11728372B2Aug 15, 2023

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations73
US10825889B2Nov 3, 2020

Semiconductor device including capacitor and method of forming the same

SAMSUNG ELECTRONICS CO LTD3 citations73
US10103026B2Oct 16, 2018

Methods of forming material layer

SAMSUNG ELECTRONICS CO LTD3 citations73
US7722926B2May 25, 2010

Organometallic compounds and methods of forming thin films including the use of the same

SAMSUNG ELECTRONICS CO LTD6 citations73
US6838719B2Jan 4, 2005

Dram cell capacitors having U-shaped electrodes with rough inner and outer surfaces

SAMSUNG ELECTRONICS CO LTD10 citations73
US11735637B2Aug 22, 2023

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations72
US11127828B2Sep 21, 2021

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD3 citations72
US10756185B2Aug 25, 2020

Semiconductor device including vertical channel layer and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations72
US9153590B2Oct 6, 2015

Semiconductor devices including buried channels

SAMSUNG ELECTRONICS CO LTD4 citations72
US9543196B2Jan 10, 2017

Methods of fabricating semiconductor devices using nanowires

SAMSUNG ELECTRONICS CO LTD2 citations71
US6809363B2Oct 26, 2004

Storage electrode of a semiconductor memory device

SAMSUNG ELECTRONICS CO LTD9 citations71
US7432183B2Oct 7, 2008

Methods of manufacturing a thin film including zirconium titanium oxide and methods of manufacturing a gate structure, a capacitor and a flash memory device including the same

SAMSUNG ELECTRONICS CO LTD3 citations63
US7091102B2Aug 15, 2006

Methods of forming integrated circuit devices having a capacitor with a hydrogen barrier spacer on a sidewall thereof and integrated circuit devices formed thereby

SAMSUNG ELECTRONICS CO LTD4 citations63
US7034350B2Apr 25, 2006

Capacitors including a cavity containing a buried layer

SAMSUNG ELECTRONICS CO LTD3 citations63
US12230667B2Feb 18, 2025

Semiconductor device including capacitor and method of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US12125872B2Oct 22, 2024

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11737277B2Aug 22, 2023

Vertical memory device with a channel layer in a stacked dielectric layer

SAMSUNG ELECTRONICS CO LTD0 citations62
US11411069B2Aug 9, 2022

Semiconductor device including capacitor and method of forming the same

SAMSUNG ELECTRONICS CO LTD0 citations62
US11189636B2Nov 30, 2021

Vertical memory device with a channel layer in a stacked dielectric layer

SAMSUNG ELECTRONICS CO LTD0 citations62
US10468256B2Nov 5, 2019

Methods of forming material layer

SAMSUNG ELECTRONICS CO LTD1 citations62
US12336260B2Jun 17, 2025

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations61
US10651194B2May 12, 2020

Semiconductor device including dielectric layer

SAMSUNG ELECTRONICS CO LTD0 citations52
US10090323B2Oct 2, 2018

Semiconductor device including dielectric layer

SAMSUNG ELECTRONICS CO LTD0 citations52
US9449973B2Sep 20, 2016

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations52
US10685959B2Jun 16, 2020

Electrode structure, method of fabricating the same, and semiconductor device including the electrode structure

SAMSUNG ELECTRONICS CO LTD0 citations51
US9646971B2May 9, 2017

Semiconductor devices including nanowire capacitors and fabricating methods thereof

SAMSUNG ELECTRONICS CO LTD1 citations51
US8039344B2Oct 18, 2011

Methods of forming a capacitor structure and methods of manufacturing a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD1 citations51
US12557261B2Feb 17, 2026

Fabricating equipment for semiconductor device and method for fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations50
US6649502B2Nov 18, 2003

Methods of forming multilayer dielectric regions using varied deposition parameters

SAMSUNG ELECTRONICS CO LTD1 citations50

KIM YOUNG-KUK

2 patents

LEE DONG-KAK

2 patents

OH JUNG-HWAN

1 patent

PARK YOUNG-GEUN

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.