Inventor
LIM HAN JIN
KR55 patents
⚠️ This page may combine multiple inventors who share the name “LIM HAN JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
44 patentsUS7271055B2Sep 18, 2007
Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitors
SAMSUNG ELECTRONICS CO LTD26 citations92
US6284589B1Sep 4, 2001
Method of fabricating concave capacitor including adhesion spacer
SAMSUNG ELECTRONICS CO LTD30 citations92
US6583056B2Jun 24, 2003
Storage electrode of a semiconductor memory device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD19 citations90
US11322578B2May 3, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations84
US10403638B2Sep 3, 2019
Vertical memory devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations84
US9716094B2Jul 25, 2017
Semiconductor device having capacitor and method of fabricating the semiconductor device
SAMSUNG ELECTRONICS CO LTD7 citations84
US9362422B2Jun 7, 2016
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD15 citations84
US10325992B2Jun 18, 2019
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations83
US9041122B2May 26, 2015
Semiconductor devices having metal silicide layers and methods of manufacturing such semiconductor devices
SAMSUNG ELECTRONICS CO LTD16 citations83
US6930013B2Aug 16, 2005
Method of forming a capacitor of an integrated circuit device
SAMSUNG ELECTRONICS CO LTD19 citations83
US9455259B2Sep 27, 2016
Semiconductor devices including diffusion barriers with high electronegativity metals
SAMSUNG ELECTRONICS CO LTD11 citations82
US8012823B2Sep 6, 2011
Methods of fabricating stack type capacitors of semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations82
US9437420B2Sep 6, 2016
Capacitors including amorphous dielectric layers and methods of forming the same
SAMSUNG ELECTRONICS CO LTD10 citations81
US7049232B2May 23, 2006
Methods for forming ruthenium films with β-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US6743678B2Jun 1, 2004
Methods for manufacturing semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD11 citations74
US11728372B2Aug 15, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations73
US10825889B2Nov 3, 2020
Semiconductor device including capacitor and method of forming the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US10103026B2Oct 16, 2018
Methods of forming material layer
SAMSUNG ELECTRONICS CO LTD3 citations73
US7722926B2May 25, 2010
Organometallic compounds and methods of forming thin films including the use of the same
SAMSUNG ELECTRONICS CO LTD6 citations73
US6838719B2Jan 4, 2005
Dram cell capacitors having U-shaped electrodes with rough inner and outer surfaces
SAMSUNG ELECTRONICS CO LTD10 citations73
US11735637B2Aug 22, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US11127828B2Sep 21, 2021
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US10756185B2Aug 25, 2020
Semiconductor device including vertical channel layer and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD6 citations72
US9153590B2Oct 6, 2015
Semiconductor devices including buried channels
SAMSUNG ELECTRONICS CO LTD4 citations72
US9543196B2Jan 10, 2017
Methods of fabricating semiconductor devices using nanowires
SAMSUNG ELECTRONICS CO LTD2 citations71
US6809363B2Oct 26, 2004
Storage electrode of a semiconductor memory device
SAMSUNG ELECTRONICS CO LTD9 citations71
US7432183B2Oct 7, 2008
Methods of manufacturing a thin film including zirconium titanium oxide and methods of manufacturing a gate structure, a capacitor and a flash memory device including the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7091102B2Aug 15, 2006
Methods of forming integrated circuit devices having a capacitor with a hydrogen barrier spacer on a sidewall thereof and integrated circuit devices formed thereby
SAMSUNG ELECTRONICS CO LTD4 citations63
US7034350B2Apr 25, 2006
Capacitors including a cavity containing a buried layer
SAMSUNG ELECTRONICS CO LTD3 citations63
US12230667B2Feb 18, 2025
Semiconductor device including capacitor and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12125872B2Oct 22, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11737277B2Aug 22, 2023
Vertical memory device with a channel layer in a stacked dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11411069B2Aug 9, 2022
Semiconductor device including capacitor and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11189636B2Nov 30, 2021
Vertical memory device with a channel layer in a stacked dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations62
US10468256B2Nov 5, 2019
Methods of forming material layer
SAMSUNG ELECTRONICS CO LTD1 citations62
US12336260B2Jun 17, 2025
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10651194B2May 12, 2020
Semiconductor device including dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US10090323B2Oct 2, 2018
Semiconductor device including dielectric layer
SAMSUNG ELECTRONICS CO LTD0 citations52
US9449973B2Sep 20, 2016
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US10685959B2Jun 16, 2020
Electrode structure, method of fabricating the same, and semiconductor device including the electrode structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US9646971B2May 9, 2017
Semiconductor devices including nanowire capacitors and fabricating methods thereof
SAMSUNG ELECTRONICS CO LTD1 citations51
US8039344B2Oct 18, 2011
Methods of forming a capacitor structure and methods of manufacturing a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD1 citations51
US12557261B2Feb 17, 2026
Fabricating equipment for semiconductor device and method for fabricating semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations50
US6649502B2Nov 18, 2003
Methods of forming multilayer dielectric regions using varied deposition parameters
SAMSUNG ELECTRONICS CO LTD1 citations50
KIM YOUNG-KUK
2 patentsLEE DONG-KAK
2 patentsUS9349821B2May 24, 2016
Electrode structure, method of fabricating the same, and semiconductor device including the electrode structure
LEE DONG-KAK3 citations71
US9202813B2Dec 1, 2015
Electrode structure, method of fabricating the same, and semiconductor device including the electrode structure
LEE DONG-KAK1 citations61
OH JUNG-HWAN
1 patentPARK YOUNG-GEUN
1 patentShowing the top 50 of 55 patents by PatentIndex Score.