Inventor
SUNG KI JUN
KR25 patents
⚠️ This page may combine multiple inventors who share the name “SUNG KI JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SK HYNIX INC
23 patentsUS9460990B1Oct 4, 2016
Substrates and semiconductor packages including the same, electronic systems including the semiconductor packages, and memory cards including the semiconductor packages
SK HYNIX INC7 citations83
US10170456B2Jan 1, 2019
Semiconductor packages including heat transferring blocks and methods of manufacturing the same
SK HYNIX INC7 citations76
US11495545B2Nov 8, 2022
Semiconductor package including a bridge die
SK HYNIX INC3 citations73
US11322446B2May 3, 2022
System-in-packages including a bridge die
SK HYNIX INC5 citations73
US10658332B2May 19, 2020
Stack packages including bridge dies
SK HYNIX INC5 citations73
US10643973B2May 5, 2020
Semiconductor packages including a multi-chip stack
SK HYNIX INC3 citations72
US9922965B2Mar 20, 2018
Manufacturing methods semiconductor packages including through mold connectors
SK HYNIX INC3 citations72
US9847285B1Dec 19, 2017
Semiconductor packages including heat spreaders and methods of manufacturing the same
SK HYNIX INC2 citations72
US9847322B2Dec 19, 2017
Semiconductor packages including through mold ball connectors and methods of manufacturing the same
SK HYNIX INC3 citations72
US9806015B1Oct 31, 2017
Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same
SK HYNIX INC4 citations72
US9659910B1May 23, 2017
Manufacturing methods semiconductor packages including through mold connectors
SK HYNIX INC2 citations72
US9324688B2Apr 26, 2016
Embedded packages having a connection joint group
SK HYNIX INC6 citations72
US9640473B2May 2, 2017
Semiconductor packages
SK HYNIX INC6 citations71
US10903196B2Jan 26, 2021
Semiconductor packages including bridge die
SK HYNIX INC3 citations64
US10971452B2Apr 6, 2021
Semiconductor package including electromagnetic interference shielding layer
SK HYNIX INC1 citations62
US10903131B2Jan 26, 2021
Semiconductor packages including bridge die spaced apart from semiconductor die
SK HYNIX INC1 citations62
US9153557B2Oct 6, 2015
Chip stack embedded packages
SK HYNIX INC3 citations62
US10811359B2Oct 20, 2020
Stack packages relating to bridge die
SK HYNIX INC1 citations54
US9837360B2Dec 5, 2017
Wafer level packages and electronics system including the same
SK HYNIX INC1 citations50
US10985106B2Apr 20, 2021
Stack packages including bridge dies
SK HYNIX INC0 citations49
US11804474B2Oct 31, 2023
Stack packages and methods of manufacturing the same
SK HYNIX INC0 citations48
US11444063B2Sep 13, 2022
Semiconductor package including vertical interconnector
SK HYNIX INC0 citations48
US10553567B2Feb 4, 2020
Chip stack packages
SK HYNIX INC0 citations42