Inventor · disambiguated record
Chia-Jen Kao
Also filed as: KAO CHIA-JEN
8 granted patents·1 pending application·24 citations·filing 2002–2018
80Inventor score
Files withGLOBAL UNICHIP CORP3UNITED MICROELECTRONICS CORP2CHEN CHIEN-WEN1CHU SHIN-CHENG1KAO CHIA-JEN1
Top patents by PatentIndex Score
9 records- 0174US8518722B2Method for detecting the under-fill void in flip chip BGACHEN CHIEN-WEN·Filed 2011·Granted Aug 27, 2013·5 cites·16 claims
- 0261US7019545B2Method for monitoring quality of an insulation layerUNITED MICROELECTRONICS CORP·Filed 2004·Granted Mar 28, 2006·9 cites·42 claims
- 0358US8397380B2Controlling warpage in BGA components in a re-flow processKAO CHIA-JEN·Filed 2010·Granted Mar 19, 2013·2 cites·15 claims
- 0455US6894517B2Method for monitoring oxide qualityUNITED MICROELECTRONICS CORP·Filed 2002·Granted May 17, 2005·8 cites·43 claims
- 0544US10352965B2Testing deviceGLOBAL UNICHIP CORP·Filed 2017·Granted Jul 16, 2019·0 cites·13 claims
- 0638US10105737B2Cleaning apparatusGLOBAL UNICHIP CORP·Filed 2016·Granted Oct 23, 2018·0 cites·13 claims
- 0732US10332765B1Wafer shipping deviceGLOBAL UNICHIP CORP·Filed 2018·Granted Jun 25, 2019·0 cites·9 claims
- 0831US2008270056A1Wafer-level reliability yield enhancement system and related methodYANG YUN-CHI·Filed 2007·Application pending·0 cites
- 0927US8816708B2Electronic test system and associated methodCHU SHIN-CHENG·Filed 2012·Granted Aug 26, 2014·0 cites·15 claims
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