Inventor
SAKODA HIDEHARU
JP25 patents
⚠️ This page may combine multiple inventors who share the name “SAKODA HIDEHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
22 patentsUS6376921B1Apr 23, 2002
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD120 citations99
US6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US6573121B2Jun 3, 2003
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD126 citations98
US6025650AFeb 15, 2000
Semiconductor device including a frame terminal
FUJITSU LTD220 citations98
US6159770ADec 12, 2000
Method and apparatus for fabricating semiconductor device
FUJITSU LTD212 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US5804468ASep 8, 1998
Process for manufacturing a packaged semiconductor having a divided leadframe stage
FUJITSU LTD65 citations96
US5569625AOct 29, 1996
Process for manufacturing a plural stacked leadframe semiconductor device
FUJITSU LTD47 citations96
US5497032AMar 5, 1996
Semiconductor device and lead frame therefore
FUJITSU LTD65 citations96
US7192798B2Mar 20, 2007
Fingerprint sensor apparatus and manufacturing method thereof
FUJITSU LTD28 citations92
US7064645B2Jun 20, 2006
Electronic device
FUJITSU LTD46 citations92
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US5703398ADec 30, 1997
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
FUJITSU LTD51 citations92
US6670221B2Dec 30, 2003
Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
FUJITSU LTD14 citations84
US5399804AMar 21, 1995
Semiconductor device and method of producing the same
FUJITSU LTD16 citations82
US6271583B1Aug 7, 2001
Semiconductor device having resin encapsulated package structure
FUJITSU LTD7 citations74
US5808357ASep 15, 1998
Semiconductor device having resin encapsulated package structure
FUJITSU LTD11 citations74
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63
US6031280AFeb 29, 2000
Semiconductor device having resin encapsulated package structure
FUJITSU LTD4 citations63
US6777250B1Aug 17, 2004
Manufacture of wafer level semiconductor device with quality markings on the sealing resin
FUJITSU LTD6 citations61
SHINKO ELECTRIC IND CO
3 patentsUS6339261B1Jan 15, 2002
Semiconductor device and process of producing same
SHINKO ELECTRIC IND CO22 citations91
US6700198B2Mar 2, 2004
Resin for semiconductor wire
SHINKO ELECTRIC IND CO8 citations71
US6348416B1Feb 19, 2002
Carrier substrate for producing semiconductor device
SHINKO ELECTRIC IND CO9 citations71