Inventor · disambiguated record
Achim Neu
Also filed as: NEU ACHIM
8 granted patents·1 pending application·158 citations·filing 1998–2001
87Inventor score
Top patents by PatentIndex Score
9 records- 0182US6380616B1Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 30, 2002·52 cites·24 claims
- 0274US6469086B1Plastic molding compound, composite body, and filler for a plastic molding compoundINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 22, 2002·23 cites·31 claims
- 0365US6400006B2Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 4, 2002·12 cites·5 claims
- 0464US6201467B1Pressure sensor component and production methodINFINEON TECHNOLOGIES AG·Filed 1999·Granted Mar 13, 2001·22 cites·11 claims
- 0561US6036173ASemiconductor element having a carrying device and a lead frame and a semiconductor chip connected theretoSIEMENS AG·Filed 1998·Granted Mar 14, 2000·31 cites·11 claims
- 0650US6313514B1Pressure sensor componentINFINEON TECHNOLOGIES AG·Filed 1998·Granted Nov 6, 2001·18 cites·10 claims
- 0734US2001002119A1Method of producing a pressure sensor componentSIEMENS AG·Filed 2001·Application pending·0 cites
- 0833US6429537B2Semiconductor component with method for manufacturingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 6, 2002·0 cites·11 claims
- 0930US6436731B2Method of producing a semiconductor device comprising a cleaning process for removing silicon-containing materialINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 20, 2002·0 cites·10 claims
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