Method of producing a pressure sensor component

Abstract

The invention relates to a method of producing a pressure sensor component with a chip carrier which has a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface. The method comprises the steps of mounting and contacting a semiconductor chip with a pressure sensor on a substantially planar chip carrier surface of a chip carrier; placing a chimney-shaped connection piece onto the semiconductor chip to project upward from a pressure-detecting surface of the pressure sensor and to expose the pressure-detecting surface to a pressure to be measured, and pressure-tightly enclosing at least the pressure-detecting surface of the pressure sensor with an end of the connection piece bearing on the semiconductor chip; and encapsulating the pressure sensor component with a component encapsulation of an electrically insulating material, the component encapsulation enclosing one of the semiconductor chip and the chip carrier and enclosing a portion of the connection piece.

We claim:  
     
         1 . A method of producing a pressure sensor component with a chip carrier having a substantially planar chip carrier surface and a semiconductor chip with an integrated pressure sensor on the chip carrier surface, which comprises the following steps: 
 mounting and contacting a semiconductor chip with a pressure sensor on a substantially planar chip carrier surface of a chip carrier;    placing a chimney-shaped connection piece onto the semiconductor chip to project upward from a pressure-detecting surface of the pressure sensor and to expose the pressure-detecting surface to a pressure to be measured, and pressure-tightly enclosing at least the pressure-detecting surface of the pressure sensor with an end of the connection piece bearing on the semiconductor chip; and    encapsulating the pressure sensor component with a component encapsulation of an electrically insulating material, the component encapsulation enclosing one of the semiconductor chip and the chip carrier and enclosing a portion of the connection piece.    
     
     
         2 . The method according to    claim 1   , wherein the placing step comprises permanently affixing the chimney-shaped connection piece on the semiconductor chip, in particular by adhesive bonding or bonding, prior to encapsulation.  
     
     
         3 . The method according to    claim 1   , wherein the permanently affixing step comprises adhesively bonding the connection piece on the semiconductor chip.  
     
     
         4 . The method according to    claim 1   , wherein the permanently affixing step comprises bonding the connection piece on the semiconductor chip.  
     
     
         5 . The method according to    claim 1   , wherein the encapsulating step comprises injection molding the semiconductor pressure sensor on the chip carrier and with the chimney-shaped connection piece in place.