Inventor · disambiguated record
Thies Janczek
Also filed as: JANCZEK THIES
9 granted patents·1 pending application·165 citations·filing 1998–2006
90Inventor score
Top patents by PatentIndex Score
10 records- 0174US6469086B1Plastic molding compound, composite body, and filler for a plastic molding compoundINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 22, 2002·23 cites·31 claims
- 0269US6020627AChip card and method of manufacturing a chip cardSIEMENS AG·Filed 1998·Granted Feb 1, 2000·38 cites·14 claims
- 0365US6400006B2Integrated component, composite element comprising an integrated component and a conductor structure, chip card, and method of producing the integrated componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 4, 2002·12 cites·5 claims
- 0464US7516900B2Data carrierJANCZEK THIES·Filed 2006·Granted Apr 14, 2009·4 cites·18 claims
- 0564US6201467B1Pressure sensor component and production methodINFINEON TECHNOLOGIES AG·Filed 1999·Granted Mar 13, 2001·22 cites·11 claims
- 0661US6036173ASemiconductor element having a carrying device and a lead frame and a semiconductor chip connected theretoSIEMENS AG·Filed 1998·Granted Mar 14, 2000·31 cites·11 claims
- 0750US6313514B1Pressure sensor componentINFINEON TECHNOLOGIES AG·Filed 1998·Granted Nov 6, 2001·18 cites·10 claims
- 0844US6186008B1Semiconductor sensor componentSIEMENS AG·Filed 1999·Granted Feb 13, 2001·10 cites·16 claims
- 0939US6364205B1Chip card having a contact zone and method of producing such a chip cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 2, 2002·7 cites·10 claims
- 1034US2001002119A1Method of producing a pressure sensor componentSIEMENS AG·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →