Inventor

HAM SUK-JIN

KR22 patents

⚠️ This page may combine multiple inventors who share the name “HAM SUK-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAM SUK-JIN

SAMSUNG ELECTRO MECH

Insulating composition for substrate, and prepreg and substrate using the same

Insulating layer composition for substrate, and prepreg and substrate using the same

Touch sensor

Method of manufacturing printed circuit board

Apparatus and method for testing semiconductor device

Electronic component package

Touch panel and producing method for via electrode

In nanowire, device using the same and method of manufacturing in nanowire

Printed circuit board and method of manufacturing the same

Apparatus for testing switching of power semiconductor module

System of measuring warpage and method of measuring warpage

SAMSUNG ELECTRONICS CO LTD

Micro-package, multi-stack micro-package, and manufacturing method therefor

Micro-package, multi-stack micro-package, and manufacturing method therefor

Wafer level package for surface acoustic wave device and fabrication method thereof

Wafer level packaging cap and fabrication method thereof

Packaging chip and packaging method thereof

Wafer level incapsulation chip and encapsulation chip manufacturing method

Light emitting device and method of manufacturing the same

LEE KWANG JIK

Multilayer ceramic electronic component and method of manufacturing the same

Organic light emitting device with a protective layer including at least one of a nano-clay and a graphite oxide formed on the anode

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

Multilayer thin film for ceramic electronic component and method of manufacturing the same