Inventor · disambiguated record
Dae-Sang Chan
Also filed as: CHAN DAE-SANG
7 granted patents·4 pending applications·30 citations·filing 2006–2018
80Inventor score
Files withSAMSUNG ELECTRONICS CO LTD11
Top patents by PatentIndex Score
11 records- 0186US10410990B2Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·6 cites·20 claims
- 0281US7745932B2Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 29, 2010·11 cites·39 claims
- 0379US7591714B2Wafer grinding and tape attaching apparatus and methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 22, 2009·7 cites·18 claims
- 0472US7713788B2Method of manufacturing semiconductor package using redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 11, 2010·5 cites·24 claims
- 0556US7696615B2Semiconductor device having pillar-shaped terminalSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 13, 2010·1 cites·15 claims
- 0647US7863161B2Method of cutting a waferSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 4, 2011·0 cites·13 claims
- 0743US2008070382A1Fixing apparatus for semiconductor waferSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0843US2007193920A1Apparatus and method for separating a semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0942US2007057410A1Method of fabricating wafer chipsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1040US8956923B2Methods of fabricating semiconductor devices and underfill equipment for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·0 cites·12 claims
- 1136US2011110062A1Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →