Inventor
SIN WHA-SU
KR11 patents
⚠️ This page may combine multiple inventors who share the name “SIN WHA-SU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS7420814B2Sep 2, 2008
Package stack and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD25 citations92
US7745932B2Jun 29, 2010
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD11 citations83
US7235887B2Jun 26, 2007
Semiconductor package with improved chip attachment and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD16 citations79
US7576438B2Aug 18, 2009
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US7427558B2Sep 23, 2008
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD4 citations62
US7713788B2May 11, 2010
Method of manufacturing semiconductor package using redistribution substrate
SAMSUNG ELECTRONICS CO LTD5 citations61
US7452753B2Nov 18, 2008
Method of processing a semiconductor wafer for manufacture of semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations59
US8039972B2Oct 18, 2011
Printed circuit board and method thereof and a solder ball land and method thereof
SAMSUNG ELECTRONICS CO LTD1 citations51
US7696615B2Apr 13, 2010
Semiconductor device having pillar-shaped terminal
SAMSUNG ELECTRONICS CO LTD1 citations50
US7863161B2Jan 4, 2011
Method of cutting a wafer
SAMSUNG ELECTRONICS CO LTD0 citations40