Inventor · disambiguated record
Ryohei Masui
Also filed as: MASUI RYOHEI
4 granted patents·20 citations·filing 2008–2013
65Inventor score
Top patents by PatentIndex Score
4 records- 0186US7838577B2Adhesive for electronic componentSEKISUI CHEMICAL CO LTD·Filed 2008·Granted Nov 23, 2010·19 cites·8 claims
- 0265US9446484B2Conductive particles, method for producing conductive particles, conductive material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2013·Granted Sep 20, 2016·1 cites·10 claims
- 0330US8901207B2Adhesive for electronic componentsHAYAKAWA AKINOBU·Filed 2010·Granted Dec 2, 2014·0 cites·6 claims
- 0429US8563362B2Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particlesHAYAKAWA AKINOBU·Filed 2010·Granted Oct 22, 2013·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →