Inventor
GUO XIAOYING
US24 patents
⚠️ This page may combine multiple inventors who share the name “GUO XIAOYING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS11990427B2May 21, 2024
Chiplet first architecture for die tiling applications
INTEL CORP2 citations73
US11973041B2Apr 30, 2024
Chiplet first architecture for die tiling applications
INTEL CORP2 citations73
US11769735B2Sep 26, 2023
Chiplet first architecture for die tiling applications
INTEL CORP1 citations73
US11088103B2Aug 10, 2021
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP3 citations72
US12456705B2Oct 28, 2025
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP0 citations62
US12354992B2Jul 8, 2025
First layer interconnect first on carrier approach for EMIB patch
INTEL CORP0 citations62
US12308329B2May 20, 2025
Chiplet first architecture for die tiling applications
INTEL CORP0 citations62
US11404389B2Aug 2, 2022
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages
INTEL CORP0 citations62
US11955448B2Apr 9, 2024
Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches
INTEL CORP0 citations61
US12341117B2Jun 24, 2025
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates
INTEL CORP0 citations60
US12354883B2Jul 8, 2025
Omni directional interconnect with magnetic fillers in mold matrix
INTEL CORP0 citations59
US12334422B2Jun 17, 2025
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates
INTEL CORP0 citations55
US11948898B2Apr 2, 2024
Etch barrier for microelectronic packaging conductive structures
INTEL CORP0 citations50
US11942334B2Mar 26, 2024
Microelectronic assemblies having conductive structures with different thicknesses
INTEL CORP0 citations50
US12255130B2Mar 18, 2025
Airgap structures for high speed signal integrity
INTEL CORP0 citations48
US12142567B2Nov 12, 2024
Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density
INTEL CORP0 citations46