P

Inventor

GUO XIAOYING

US24 patents
⚠️ This page may combine multiple inventors who share the name “GUO XIAOYING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

16 patents
US11990427B2May 21, 2024

Chiplet first architecture for die tiling applications

INTEL CORP2 citations73
US11973041B2Apr 30, 2024

Chiplet first architecture for die tiling applications

INTEL CORP2 citations73
US11769735B2Sep 26, 2023

Chiplet first architecture for die tiling applications

INTEL CORP1 citations73
US11088103B2Aug 10, 2021

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP3 citations72
US12456705B2Oct 28, 2025

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP0 citations62
US12354992B2Jul 8, 2025

First layer interconnect first on carrier approach for EMIB patch

INTEL CORP0 citations62
US12308329B2May 20, 2025

Chiplet first architecture for die tiling applications

INTEL CORP0 citations62
US11404389B2Aug 2, 2022

In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages

INTEL CORP0 citations62
US11955448B2Apr 9, 2024

Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches

INTEL CORP0 citations61
US12341117B2Jun 24, 2025

Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates

INTEL CORP0 citations60
US12354883B2Jul 8, 2025

Omni directional interconnect with magnetic fillers in mold matrix

INTEL CORP0 citations59
US12334422B2Jun 17, 2025

Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates

INTEL CORP0 citations55
US11948898B2Apr 2, 2024

Etch barrier for microelectronic packaging conductive structures

INTEL CORP0 citations50
US11942334B2Mar 26, 2024

Microelectronic assemblies having conductive structures with different thicknesses

INTEL CORP0 citations50
US12255130B2Mar 18, 2025

Airgap structures for high speed signal integrity

INTEL CORP0 citations48
US12142567B2Nov 12, 2024

Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density

INTEL CORP0 citations46

TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

2 patents

UNIV GUANGDONG TECHNOLOGY

1 patent

THE INTEL CORP

1 patent

KIRSHNASWAMY RAJA

1 patent

BEIJING XIAOMI MOBILE SOFTWARE CO LTD

1 patent

MICROSOFT TECHNOLOGY LICENSING LLC

1 patent

SICHUAN KELUN PHARMACEUTICAL

1 patent