Inventor

KAPUSTA CHRISTOPHER JAMES

US79 patents

⚠️ This page may combine multiple inventors who share the name “KAPUSTA CHRISTOPHER JAMES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAPUSTA CHRISTOPHER JAMES

GEN ELECTRIC

System and method of forming a low profile conformal shield

Electronics package having a self-aligning interconnect assembly and method of making same

Interconnect device

Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components

MEMS based current sensor using magnetic-to-mechanical conversion and reference components

Piezoelectric microvalve

Optoelectronic package and fabrication method

Microelectromechanical system device packaging method

Microelectromechanical system device packaging method

Stackable electronic package

Embedded RF filter package structure and method of manufacturing thereof

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same

Sealed wafer packaging of microelectromechanical systems

Method of making an electronic device cooling system

Method of processing high-resolution flex circuits with low distortion

Micro-electromechanical system (MEMS) based current and magnetic field sensor having capacitive sense components

Apparatus and method of forming high performance integrated RF optical module

Sensor system and method

Sensor system and method

Non-magnetic package and method of manufacture

Non-magnetic package and method of manufacture

Systems and methods for quartz wafer bonding

Method for making a seam-sealable non-magnetic lid and package

Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same

Radio frequency die package with inverted ground plane and method of making same

Electronics package with integrated interconnect structure and method of manufacturing thereof

Sensor system and method

Stackable electronic package and method of fabricating same

Method of manufacturing an electronics package using device-last or device-almost last placement

Micro-electromechanical system (MEMS) based current and magnetic field sensor having improved sensitivities

True time delay beam former module and method of making the same

Micro-electromechanical system (MEMS) based current and magnetic field sensor using tunneling current sensing

Ultra thin die electronic package

MEMS based current sensor using magnetic-to-mechanical conversion and reference components

Sensor system and method

Systems and methods for hybrid glass and organic packaging for radio frequency electronics

Low inductance stackable solid-state switching module and method of manufacturing thereof

Stackable electronic package and method of fabricating same

Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

LOCKHEED CORP

Method for making multichip module substrates by encapsulating electrical conductors and filling gaps

Wideband passive amplitude compensated time delay module

Affordable high performance high frequency multichip module fabrication and apparatus

Method for making multichip module substrates by encapsulating electrical conductors

KAPUSTA CHRISTOPHER JAMES

System and method of forming a patterned conformal structure

System and method of forming isolated conformal shielding areas

Stackable electronic package and method of making same

Integrated circuit package and method of making same

WODNICKI ROBERT GIDEON

Ultrasound acoustic assemblies and methods of manufacture

SABATINI JAMES

Stackable electronic package and method of fabricating same

GE AVIATION SYSTEMS LLC

Liquid-cooled assembly and method