P

Inventor

FILLION RAYMOND ALBERT

US44 patents
⚠️ This page may combine multiple inventors who share the name “FILLION RAYMOND ALBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEN ELECTRIC

31 patents
US6396153B2May 28, 2002

Circuit chip package and fabrication method

GEN ELECTRIC163 citations99
US6242282B1Jun 5, 2001

Circuit chip package and fabrication method

GEN ELECTRIC198 citations99
US6239482B1May 29, 2001

Integrated circuit package including window frame

GEN ELECTRIC217 citations99
US6306680B1Oct 23, 2001

Power overlay chip scale packages for discrete power devices

GEN ELECTRIC304 citations98
US6507113B1Jan 14, 2003

Electronic interface structures and methods of fabrication

GEN ELECTRIC58 citations96
US5946546AAug 31, 1999

Chip burn-in and test structure and method

GEN ELECTRIC52 citations96
US5888837AMar 30, 1999

Chip burn-in and test structure and method

GEN ELECTRIC83 citations96
US6239980B1May 29, 2001

Multimodule interconnect structure and process

GEN ELECTRIC91 citations95
US10504826B1Dec 10, 2019

Device almost last embedded device structure and method of manufacturing thereof

GEN ELECTRIC24 citations94
US7262444B2Aug 28, 2007

Power semiconductor packaging method and structure

GEN ELECTRIC50 citations92
US10396053B2Aug 27, 2019

Semiconductor logic device and system and method of embedded packaging of same

GEN ELECTRIC7 citations84
US10211141B1Feb 19, 2019

Semiconductor logic device and system and method of embedded packaging of same

GEN ELECTRIC13 citations84
US9953917B1Apr 24, 2018

Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof

GEN ELECTRIC11 citations84
US9953913B1Apr 24, 2018

Electronics package with embedded through-connect structure and method of manufacturing thereof

GEN ELECTRIC10 citations84
US8049338B2Nov 1, 2011

Power semiconductor module and fabrication method

GEN ELECTRIC14 citations84
US8008781B2Aug 30, 2011

Apparatus and method for reducing pitch in an integrated circuit

GEN ELECTRIC9 citations84
US7829386B2Nov 9, 2010

Power semiconductor packaging method and structure

GEN ELECTRIC8 citations84
US6933813B2Aug 23, 2005

Interconnection structure with etch stop

GEN ELECTRIC11 citations74
US6671948B2Jan 6, 2004

Interconnection method using an etch stop

GEN ELECTRIC7 citations74
US10692737B2Jun 23, 2020

Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereof

GEN ELECTRIC3 citations73
US10497648B2Dec 3, 2019

Embedded electronics package with multi-thickness interconnect structure and method of making same

GEN ELECTRIC2 citations73
US10276523B1Apr 30, 2019

Semiconductor logic device and system and method of embedded packaging of same

GEN ELECTRIC4 citations73
US10804115B2Oct 13, 2020

Electronics package with integrated interconnect structure and method of manufacturing thereof

GEN ELECTRIC3 citations72
US10332832B2Jun 25, 2019

Method of manufacturing an electronics package using device-last or device-almost last placement

GEN ELECTRIC2 citations72
US7964974B2Jun 21, 2011

Electronic chip package with reduced contact pad pitch

GEN ELECTRIC4 citations62
US10892231B2Jan 12, 2021

Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

GEN ELECTRIC0 citations61
US10804116B2Oct 13, 2020

Electronics package with integrated interconnect structure and method of manufacturing thereof

GEN ELECTRIC1 citations61
US10566301B2Feb 18, 2020

Semiconductor logic device and system and method of embedded packaging of same

GEN ELECTRIC0 citations52
US10541209B2Jan 21, 2020

Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof

GEN ELECTRIC0 citations51
US10541153B2Jan 21, 2020

Electronics package with integrated interconnect structure and method of manufacturing thereof

GEN ELECTRIC0 citations51
US7956457B2Jun 7, 2011

System and apparatus for venting electronic packages and method of making same

GEN ELECTRIC1 citations48

FILLION RAYMOND ALBERT

6 patents

WOYCHIK CHARLES GERARD

2 patents

MOMENTIVE PERFORMANCE MAT INC

1 patent

DELGADO ELADIO CLEMENTE

1 patent

LOCKHEED CORP

1 patent

HUBER WILLIAM HULLINGER

1 patent

BRONECKE PETER N

1 patent