Inventor

KAMIYAMA KENICHI

JP8 patents

⚠️ This page may combine multiple inventors who share the name “KAMIYAMA KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

5 patents

US7615277B2Nov 10, 2009

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

HITACHI CHEMICAL CO LTD10 citations82

US7964289B2Jun 21, 2011

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

HITACHI CHEMICAL CO LTD5 citations72

US7629045B2Dec 8, 2009

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

HITACHI CHEMICAL CO LTD2 citations61

US7862889B2Jan 4, 2011

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

HITACHI CHEMICAL CO LTD0 citations51

US7818877B2Oct 26, 2010

Formation method of metal layer on resin layer

HITACHI CHEMICAL CO LTD0 citations51

SONY CORP

2 patents

US7427034B2Sep 23, 2008

Information processing apparatus and loop antenna

SONY CORP4 citations61

US7729660B2Jun 1, 2010

Communication device, non-contact type IC card mounting same, and information apparatus

SONY CORP0 citations40

TAKAI KENJI

1 patent

US8815334B2Aug 26, 2014

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

TAKAI KENJI0 citations48