Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Abstract

A printed wiring board having a conductor circuit comprising a copper layer adjacent to an insulating layer and an electroless gold plating, wherein the insulating layer has ten-point mean surface roughness (Rz) of 2.0 μm or less is provided. According to the present invention, there is no such a defect that gold plating is deposited on a resin, and fine wiring formation with accuracy is realized.

1. A printed wiring board comprising an insulating layer and a conductor circuit, wherein at least a part of the conductor circuit is made of an electrolytic copper foil, and an adhesive layer between the conductor circuit and the insulating layer, wherein a surface of the conductor circuit which faces to the adhesive layer has 10-point mean surface roughness (Rz) of 2.0 μm or less, wherein the thickness of the adhesive layer is 0.1 to 5 μm, and wherein the thickness of the adhesive layer is ⅛ or thinner than the thickness of the insulating layer. 
   
   
     2. The printed wiring board according to  claim 1 , wherein the adhesive layer contains an organic material and the insulating layer comprises a composite material of an inorganic material and an organic material. 
   
   
     3. The printed wiring board according to  claim 1 , wherein the entire body of the conductor circuit is not surface-roughened. 
   
   
     4. The printed wiring board according to  claim 1 , wherein a resin having 20 ppm/° C. or lower thermal expansion coefficient in the transverse direction (CTE X, CTE Y) in a range of 0 to 150° C. is used for the insulating layer. 
   
   
     5. The printed wiring board according to  claim 1 , wherein a resin having a tensile strength of 200 MPa or higher at 20° C. is used for the insulating layer. 
   
   
     6. The printed wiring board according to  claim 1 , wherein a resin having a dielectric dissipation factor of 0.01 or lower at 1 GHz is used for the insulating layer. 
   
   
     7. The printed wiring board according to  claim 1 , wherein a resin having a dielectric constant of 3 or less at 1 GHz is used for the insulating layer. 
   
   
     8. The printed wiring board according to  claim 1 , wherein a thermosetting resin composition containing (A) polyphenylene ether or a modified polyphenylene ether is used for the insulating layer. 
   
   
     9. The printed wiring board according to  claim 1 , wherein a thermosetting resin composition containing a cyanate ester compound is used for the insulating layer. 
   
   
     10. The printed wiring board according to  claim 1 , wherein a thermosetting resin composition containing an epoxy compound is used for the insulating layer. 
   
   
     11. The printed wiring board according to  claim 1 , wherein a thermosetting resin composition containing a polyamide imide compound is used for the insulating layer. 
   
   
     12. The printed wiring board according to  claim 1 , wherein the peel strength of the insulating layer and the conductor circuit with 1 mm width is 0.6 kN/m or higher. 
   
   
     13. The printed wiring board according to  claim 1 , wherein the peel strength of the insulating layer and the conductor circuit with 1 mm width is 0.4 kN/m or higher after heating at 150° C. for 240 hours. 
   
   
     14. The printed wiring board according to  claim 1 , wherein the adhesive layer is an intermediate layer improving adhesion of the copper foil to the insulating layer, as compared to adhesion of the copper foil to the insulating layer without the adhesive layer therebetween. 
   
   
     15. The printed wiring board according to  claim 1 , wherein the adhesive layer is on the insulating layer, and the conductor circuit is on the adhesive layer. 
   
   
     16. A printed wiring board comprising an insulating layer and a conductor circuit, wherein at least a part of the conductor circuit is made of an electrolytic copper foil, and an adhesive layer between the conductor circuit and the insulating layer, wherein a surface of the conductor circuit which faces to the adhesive layer has 10-point mean surface roughness (Rz) of 2.0 μm or less, and wherein the thickness of the adhesive layer is ⅛ or thinner than the thickness of the insulating layer. 
   
   
     17. The printed wiring board according to  claim 16 , wherein the adhesive layer is an intermediate layer improving adhesion of the copper foil to the insulating layer, as compared to adhesion of the copper foil to the insulating layer without the adhesive layer therebetween. 
   
   
     18. The printed wiring board according to  claim 16 , wherein the adhesive layer is on the insulating layer, and the conductor circuit is on the adhesive layer.