P

Inventor

TAKAI KENJI

JP31 patents
⚠️ This page may combine multiple inventors who share the name “TAKAI KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

10 patents
US7615277B2Nov 10, 2009

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

HITACHI CHEMICAL CO LTD10 citations82
US7473458B2Jan 6, 2009

Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof

HITACHI CHEMICAL CO LTD11 citations82
US7740936B2Jun 22, 2010

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

HITACHI CHEMICAL CO LTD11 citations81
US7964289B2Jun 21, 2011

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

HITACHI CHEMICAL CO LTD5 citations72
US7629045B2Dec 8, 2009

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

HITACHI CHEMICAL CO LTD2 citations61
US7955689B2Jun 7, 2011

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

HITACHI CHEMICAL CO LTD2 citations60
US7749612B2Jul 6, 2010

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

HITACHI CHEMICAL CO LTD1 citations60
US7749605B2Jul 6, 2010

Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing method thereof

HITACHI CHEMICAL CO LTD1 citations60
US7862889B2Jan 4, 2011

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

HITACHI CHEMICAL CO LTD0 citations51
US7818877B2Oct 26, 2010

Formation method of metal layer on resin layer

HITACHI CHEMICAL CO LTD0 citations51

SAMSUNG ELECTRONICS CO LTD

8 patents

KYOCERA DOCUMENT SOLUTIONS INC

7 patents

SHARP KK

3 patents

TAKAI KENJI

3 patents