Inventor

MASUDA KATSUYUKI

JP31 patents

⚠️ This page may combine multiple inventors who share the name “MASUDA KATSUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MASUDA KATSUYUKI

HITACHI CHEMICAL CO LTD

Polishing fluid and polishing method

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Prepreg, metal-clad laminate and printed circuit board using same

Prepreg, metal-clad laminate and printed circuit board using same

Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Formation method of metal layer on resin layer

FUJITSU LTD

Wireless communication system and wireless communication method

Communication system, base station, and terminal

Radio access system, controlling apparatus, and terminal apparatus

SAGAMI CHEM RES

Process for producing 2-(halomethyl)phenylacetic acid esters

4-imino-oxazolidine-2-one derivatives, a process for producing such derivatives and a herbicide containing them as an active ingredient

Process for the preparation of 3-(substituted phenyl)-5-alkylidene-1,3-oxazolidine-2,4-dione derivatives

MASUDA KATSUYUKI

Adhesive agent, adhesive material using the same, and method of use thereof

Adhesive agent, adhesive material using the same, and method of use thereof

Adhesive agent, adhesive material using the same, and method of use thereof

NAKAKO HIDEO

Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition

Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution

KIKUCHI TOORU

Liquid tetracarboxylic dianhydrides and process for the preparation thereof

Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same

EVOLIUM SAS

Mobile phone system for allowing a user to transmit voice messages

TAKEUCHI MASAKI

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

EJIRI TAKAKO

Polyamide-imide resin, process for production of polyamide resin, and curable resin composition

TANAKA KENJI

Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet

KURATA YASUSHI

Polishing slurry and polishing method

TAKAI KENJI

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

SUZUKI MASAHIKO

Flexible laminate board, process for manufacturing of the board, and flexible print wiring board

ONO HIROSHI

Polishing slurry for metal, and polishing method